Selexis SA
Manufacturer and developer of semiconductor electronic materials with expertise in photoresists, CMP slurries and packaging materials. Operates R&D labs and manufacturing facilities with a global supply chain and certified quality and EHS systems.
Industries
N/A
Products
Immersion photoresists (ArF)
Photoresist formulations for ArF immersion lithography targeting low line width roughness, low defectivity and minimized mask error enhancement.
EUV-capable photoresist materials
Resist materials and formulations aimed at improving resolution and sensitivity trade-offs for EUV lithography.
ArF/KrF dry imaging photoresists
Dry imaging resist formulations for ArF and KrF lithography providing robust process latitude and improved resolution for existing toolsets.
CMP slurries
Abrasive and chemistry formulations for chemical mechanical planarization with controlled removal rates, selectivity and low defectivity (including mono-dispersed colloidal silica and titania-based formulations).
Post-CMP cleaning solutions
Aqueous cleaning chemistries optimized for particle removal after CMP and for cleaning specific barrier metals using polymeric metal inhibitors.
Spin-on dual hard mask materials
Spin-on carbon underlayers and silicon-containing hardmasks for multilayer lithography stacks with filling, planarization and reflectivity control.
Immersion photoresists (ArF)
Photoresist formulations for ArF immersion lithography targeting low line width roughness, low defectivity and minimized mask error enhancement.
EUV-capable photoresist materials
Resist materials and formulations aimed at improving resolution and sensitivity trade-offs for EUV lithography.
ArF/KrF dry imaging photoresists
Dry imaging resist formulations for ArF and KrF lithography providing robust process latitude and improved resolution for existing toolsets.
CMP slurries
Abrasive and chemistry formulations for chemical mechanical planarization with controlled removal rates, selectivity and low defectivity (including mono-dispersed colloidal silica and titania-based formulations).
Post-CMP cleaning solutions
Aqueous cleaning chemistries optimized for particle removal after CMP and for cleaning specific barrier metals using polymeric metal inhibitors.
Spin-on dual hard mask materials
Spin-on carbon underlayers and silicon-containing hardmasks for multilayer lithography stacks with filling, planarization and reflectivity control.
Expertise Areas
- Semiconductor lithography materials
- Photoresist chemistry and process development
- CMP slurry formulation and polishing chemistries
- Post-CMP cleaning and particle removal
Key Technologies
- Photoresist chemistry
- Immersion lithography materials
- EUV-targeted resist materials
- ArF/KrF dry imaging materials