Selexis SA
US-based subsidiary of a global materials corporation that develops and manufactures electronic materials for semiconductor lithography, packaging and integrated circuit processing. Operates R&D labs, manufacturing and sales offices across North America, Asia-Pacific and Europe. Maintains ISO 9001, ISO 14001 and ISO 45001 certifications and provides product support and information via web forms and regional contacts.
Industries
Nr. of Employees
small (1-50)
Selexis SA
1280 N. Mathilda Ave., Sunnyvale, CA 94089, USA
Patents
Characterization and inactivation of endogenous retroviruses in chinese hamster ovary cells
US-12404527-B2
View Details
Characterization and inactivation of endogenous retroviruses in chinese hamster ovary cells
US-12404527-B2
View DetailsProducts
Photoresists for advanced lithography
Resist formulations for immersion and dry lithography across ArF, KrF and EUV processes, optimized for low LWR, low defectivity and high resolution.
Thick negative-tone resists for plating and bumping
High-aspect-ratio, developable negative-tone resists for wafer-level chip scale packaging and bumping processes (film thickness range ~5–90 µm).
Photosensitive dielectric materials for packaging
Positive- and negative-tone photosensitive dielectrics with low thermal shrink, stress buffering, and adhesion suitable for redistribution layers and overcoat applications.
CMP slurries and abrasives
Slurry formulations incorporating mono-dispersed colloidal abrasives and additives to control removal rate, selectivity and defectivity across metal and dielectric CMP processes.
Post-etch and post-CMP cleaning chemistries
Cleaning chemistries designed for efficient residue removal and metal compatibility with corrosion inhibition and electrochemical process controls.
Spin-on dual hard mask and carbon underlayers
Spin-on carbon underlayers and silicon-rich hard masks for multilayer lithography stacks to provide planarization, reflectivity control and low outgassing.
Photoresists for advanced lithography
Resist formulations for immersion and dry lithography across ArF, KrF and EUV processes, optimized for low LWR, low defectivity and high resolution.
Thick negative-tone resists for plating and bumping
High-aspect-ratio, developable negative-tone resists for wafer-level chip scale packaging and bumping processes (film thickness range ~5–90 µm).
Photosensitive dielectric materials for packaging
Positive- and negative-tone photosensitive dielectrics with low thermal shrink, stress buffering, and adhesion suitable for redistribution layers and overcoat applications.
CMP slurries and abrasives
Slurry formulations incorporating mono-dispersed colloidal abrasives and additives to control removal rate, selectivity and defectivity across metal and dielectric CMP processes.
Post-etch and post-CMP cleaning chemistries
Cleaning chemistries designed for efficient residue removal and metal compatibility with corrosion inhibition and electrochemical process controls.
Spin-on dual hard mask and carbon underlayers
Spin-on carbon underlayers and silicon-rich hard masks for multilayer lithography stacks to provide planarization, reflectivity control and low outgassing.
Services
Web form and email-based intake for SDS requests, product information and technical inquiries; regional contact routing for Europe and Asia.
Technical discussions and customer-specific support for material selection and process integration via regional sales and technical teams.
Web form and email-based intake for SDS requests, product information and technical inquiries; regional contact routing for Europe and Asia.
Technical discussions and customer-specific support for material selection and process integration via regional sales and technical teams.
Expertise Areas
- Semiconductor lithography materials
- Packaging and wafer-level CSP materials
- CMP slurry and polishing technology
- Surface and electrochemical cleaning chemistries
Key Technologies
- Photoresist chemistry for i-line, KrF, ArF and EUV
- Chemically amplified resists
- Photosensitive dielectric formulations
- CMP slurry engineering (colloidal silica, titania abrasives)
News & Updates
Conference participation in lithography and patterning.
Customer reception during SPIE Advanced Lithography week.
Conference attendance for device packaging.
Conference participation.
Workshop attendance focused on lithography topics.
Quality management system certification.
Conference participation in lithography and patterning.
Customer reception during SPIE Advanced Lithography week.
Conference attendance for device packaging.
Conference participation.
Workshop attendance focused on lithography topics.
Quality management system certification.