Sunray Scientific, Inc.
Developer and manufacturer of engineered conductive materials and assembly systems for advanced electronic packaging. Offers anisotropic conductive adhesives, conductive inks, magnetic pallet alignment systems and flexible UV encapsulants for printed electronics, flexible wearables, X-ray imaging, LED lighting and defense applications. Provides custom materials formulation, R&D and testing, and large-scale manufacturing support.
Industries
N/A
Products
Anisotropic conductive adhesive system
Conductive epoxy system that forms immobilized Z-axis conductive columns during low-temperature or UV-assisted cure to create Z-axis electrical/thermal interconnections.
Conductive silver inks
Flexible conductive inks formulated to reduce silver migration and provide long-term durability and elasticity for printed electronics.
Magnetic pallet alignment system
Magnetic pallet hardware designed to support adhesive-based self-assembly processes and integrate with existing production workflows.
Flexible UV-curable encapsulants
Moisture-resistant encapsulants cured with UV energy to protect electronics while preserving flexibility.
Anisotropic conductive adhesive system
Conductive epoxy system that forms immobilized Z-axis conductive columns during low-temperature or UV-assisted cure to create Z-axis electrical/thermal interconnections.
Conductive silver inks
Flexible conductive inks formulated to reduce silver migration and provide long-term durability and elasticity for printed electronics.
Magnetic pallet alignment system
Magnetic pallet hardware designed to support adhesive-based self-assembly processes and integrate with existing production workflows.
Flexible UV-curable encapsulants
Moisture-resistant encapsulants cured with UV energy to protect electronics while preserving flexibility.
Services
Custom materials formulation and engineering
Tailored design of conductive inks, epoxies and encapsulants matched to customer application requirements.
Assembly system design and integration
Design and supply of magnetic pallet systems and integration support for automated assembly and self-assembly processes.
R&D, prototyping and material qualification
R&D services including prototyping, testing and qualification of conductive materials and encapsulants.
Custom materials formulation and engineering
Tailored design of conductive inks, epoxies and encapsulants matched to customer application requirements.
Assembly system design and integration
Design and supply of magnetic pallet systems and integration support for automated assembly and self-assembly processes.
R&D, prototyping and material qualification
R&D services including prototyping, testing and qualification of conductive materials and encapsulants.
Expertise Areas
- Printed electronics and fine-pitch interconnects
- Materials formulation for conductive adhesives and inks
- Flexible electronics and wearable device packaging
- Device packaging for X-ray imaging and medical devices
Key Technologies
- Anisotropic conductive adhesives
- Conductive silver inks with anti-migration additives
- Magnetic pallet alignment systems
- Low-temperature and UV-assisted cure chemistries