Atomica
Atomica is a leader in microfabrication, including photonics, sensors, biotechnology, and MEMS. We focus on the success of our customers’ products, with rapid prototyping and scalable production. Our extensive facilities support a wide range of capabilities and materials, leveraging sophisticated process control analytics, artificial intelligence inspection, advanced metrology, and proprietary fab operations systems to maximize efficiency. We serve markets such as telecommunications, automotive, healthcare, aerospace, industrial, and consumer markets, providing device optimization, faster speed to market, and cost-efficient fabrication.
Industries
Nr. of Employees
medium (51-250)
Atomica
Santa Barbara, California, United States, North America
Products
Wafer-level optical integration platform
Wafer-level platform for precise placement and integration of optical elements to produce compact optical engines for sensing and photonics applications.
TSV and interposer platform
Standard and custom interposer solutions with through-silicon via formation and electroplated RDLs to enable 2.5D and 3D heterogeneous integration.
Wafer-level packaging (WLP) platform
Wafer-level packaging processes and lid-bonding approaches to create hermetic cavities and protect optical and MEMS assemblies at scale.
Microfluidic platform modules
Standardized microfluidic structures and module templates (channels, pumps, valves, microneedles, microarray) to accelerate prototyping and scale production of biochips.
MEMS relay / switch unit-cell platform
Scalable MEMS ohmic-contact relay unit cell with electrostatic actuation designed for series/parallel stacking to meet higher voltage and current requirements and configurable for RF and DC power switching.
MEMS sensor platforms
Platform modules and process flows for common MEMS sensors including accelerometers, gyroscopes, pressure, magnetic and gas sensors optimized for rapid prototyping and scalable manufacturing.
Wafer-level optical integration platform
Wafer-level platform for precise placement and integration of optical elements to produce compact optical engines for sensing and photonics applications.
TSV and interposer platform
Standard and custom interposer solutions with through-silicon via formation and electroplated RDLs to enable 2.5D and 3D heterogeneous integration.
Wafer-level packaging (WLP) platform
Wafer-level packaging processes and lid-bonding approaches to create hermetic cavities and protect optical and MEMS assemblies at scale.
Microfluidic platform modules
Standardized microfluidic structures and module templates (channels, pumps, valves, microneedles, microarray) to accelerate prototyping and scale production of biochips.
MEMS relay / switch unit-cell platform
Scalable MEMS ohmic-contact relay unit cell with electrostatic actuation designed for series/parallel stacking to meet higher voltage and current requirements and configurable for RF and DC power switching.
MEMS sensor platforms
Platform modules and process flows for common MEMS sensors including accelerometers, gyroscopes, pressure, magnetic and gas sensors optimized for rapid prototyping and scalable manufacturing.
Services
Rapid prototyping services
Turnkey rapid prototyping workflow from design review to prototype wafers to accelerate early-stage device validation.
Scalable production and volume foundry services
Foundry services scaling from prototyping to volume manufacturing on 6" and 8" wafers supported by a class-100 cleanroom, large on-site manufacturing facility and extensive toolset for high-volume production.
Design, modeling and simulation consultancy
Design-for-manufacturing support, device modeling and simulation to improve performance, lower cost and reduce time-to-market.
Metrology, analytics and failure analysis
Analytical services for dimensional, material, electrical and surface characterization with SEM, FIB, AFM, EDS, XRF and in-line virtual metrology to support root-cause failure analysis and process control.
TSV / interposer and wafer-level packaging services
Custom TSV formation, interposer fabrication and redistribution layer plating plus wafer bonding for multi-layer 2.5D/3D integration and wafer-level packaging.
Microfluidic biochip development and manufacturing
Design and fabrication support for microfluidic channels, pumps, valves, microneedles and microarray devices including materials selection and manufacturability planning.
Rapid prototyping services
Turnkey rapid prototyping workflow from design review to prototype wafers to accelerate early-stage device validation.
Scalable production and volume foundry services
Foundry services scaling from prototyping to volume manufacturing on 6" and 8" wafers supported by a class-100 cleanroom, large on-site manufacturing facility and extensive toolset for high-volume production.
Design, modeling and simulation consultancy
Design-for-manufacturing support, device modeling and simulation to improve performance, lower cost and reduce time-to-market.
Metrology, analytics and failure analysis
Analytical services for dimensional, material, electrical and surface characterization with SEM, FIB, AFM, EDS, XRF and in-line virtual metrology to support root-cause failure analysis and process control.
TSV / interposer and wafer-level packaging services
Custom TSV formation, interposer fabrication and redistribution layer plating plus wafer bonding for multi-layer 2.5D/3D integration and wafer-level packaging.
Microfluidic biochip development and manufacturing
Design and fabrication support for microfluidic channels, pumps, valves, microneedles and microarray devices including materials selection and manufacturability planning.
Expertise Areas
- Microfabrication for MEMS, photonics, sensors and biochips
- High-aspect-ratio silicon etching and DRIE process development
- Wafer-level optical integration and silicon optical-bench architectures
- Microfluidic biochip design and manufacturability
Key Technologies
- Deep Reactive Ion Etching (DRIE)
- Reactive Ion Etching (RIE) / ICP
- Physical Vapor Deposition (PVD) / sputter / evaporation
- Chemical Vapor Deposition (CVD) / PECVD / LPCVD / HDPCVD