Applied Materials, Inc.
Provider of materials-engineering equipment, software and services for semiconductor, display and solar manufacturing. Offers thin-film deposition, etch, metrology/inspection, packaging and integration equipment; process simulation and analytics software; factory automation and equipment-host integration; supply-chain and field services; and collaborative R&D and venture investments focused on materials and process scale-up.
Industries
N/A
Products
Thin-film deposition systems (CVD, PVD, ALD, PECVD)
Equipment families and process solutions supporting chemical vapor deposition, physical vapor deposition and atomic layer deposition for semiconductor, display and solar fabs.
Etch and patterning equipment
Plasma etch and pattern-shaping tools for feature definition, photomask/reticle etch and advanced patterning processes.
Metrology, inspection and defect-analysis systems
Optical and electron-beam metrology, inspection and defect-analysis equipment for critical-dimension, overlay and defect control to support process control and yield improvement.
Advanced packaging and hybrid-bonding equipment
Equipment for die-to-wafer bonding, bumping, through-silicon vias and other heterogeneous integration processes enabling 3D stacking and chiplet assembly.
PV wafer inspection and metallization tools
Automated inspection systems and metallization/screen-printing equipment for photovoltaic wafer and cell production and printed-electronics metallization.
Process simulation and modeling software
Platform-scale simulation software for reactor, process and feature-scale modeling to accelerate process development and equipment integration.
Thin-film deposition systems (CVD, PVD, ALD, PECVD)
Equipment families and process solutions supporting chemical vapor deposition, physical vapor deposition and atomic layer deposition for semiconductor, display and solar fabs.
Etch and patterning equipment
Plasma etch and pattern-shaping tools for feature definition, photomask/reticle etch and advanced patterning processes.
Metrology, inspection and defect-analysis systems
Optical and electron-beam metrology, inspection and defect-analysis equipment for critical-dimension, overlay and defect control to support process control and yield improvement.
Advanced packaging and hybrid-bonding equipment
Equipment for die-to-wafer bonding, bumping, through-silicon vias and other heterogeneous integration processes enabling 3D stacking and chiplet assembly.
PV wafer inspection and metallization tools
Automated inspection systems and metallization/screen-printing equipment for photovoltaic wafer and cell production and printed-electronics metallization.
Process simulation and modeling software
Platform-scale simulation software for reactor, process and feature-scale modeling to accelerate process development and equipment integration.
Services
Equipment service and support
Global equipment maintenance, spare parts, lifecycle services and uptime improvement programs for manufacturing customers.
Supply-chain and parts management services
Managed parts programs including total-kit management, forecasted-parts placement and on-demand certified parts delivery through a global parts network to reduce downtime.
Cloud customer portal for documentation and ordering
Cloud-based portal for access to equipment documentation, part lists, ordering and system support to streamline service and procurement workflows.
Equipment service and support
Global equipment maintenance, spare parts, lifecycle services and uptime improvement programs for manufacturing customers.
Supply-chain and parts management services
Managed parts programs including total-kit management, forecasted-parts placement and on-demand certified parts delivery through a global parts network to reduce downtime.
Cloud customer portal for documentation and ordering
Cloud-based portal for access to equipment documentation, part lists, ordering and system support to streamline service and procurement workflows.
Expertise Areas
- Thin-film deposition and process integration
- Metrology, inspection and defect analysis
- Advanced packaging and heterogeneous integration
- Process simulation and physics-based modeling
Key Technologies
- Chemical vapor deposition (CVD)
- Plasma-enhanced CVD (PECVD)
- Physical vapor deposition (PVD)
- Atomic layer deposition (ALD)