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Precision Circuit Technologies


Precision Circuit Technologies specializes in ultra high-density circuit fabrication using advanced additive and semi-additive manufacturing processes. Leveraging proprietary techniques and materials, including liquid crystal polymer substrates and particle-free conductive inks, the company produces miniaturized, high-precision circuits and interconnects suited for next-generation electronics, high-frequency, and high-speed applications. With a strong commitment to innovation, precision, and environmental sustainability, their solutions enable rapid prototyping, miniaturization, and superior signal integrity.

Industries

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Precision Circuit Technologies

Northland Interstate Business Center III, 7115 Northland Terrace, Suite 400, Brooklyn Park, Minnesota 55428


Products

Liquid Crystal Polymer Circuits and Microelectronics Integration

A new facility has been deployed in Brooklyn Park, MN, with the most advanced circuit fabrication and LCP capabilities available. Sub-10 micron lines and spaces, High Layer Count LCP, Hermetic LCP, and Noble Conductors. Embedded active die, passive components and biometric sensors.

Expertise Areas

  • High-density interconnect circuit manufacturing
  • Additive and semi-additive electronics manufacturing
  • Miniaturization for electronic systems
  • RF, microwave, and high-frequency circuit design
  • Show More (3)

Key Technologies

  • Liquid crystal polymer substrates
  • Additive manufacturing for PCBs
  • Semi-additive PCB fabrication
  • Particle-free conductive metal inks
  • Show More (6)

News & Updates

Over 37 patents issued and 14 pending covering high-density circuit, materials, and manufacturing processes.

Podcast featuring Jim Rathburn discussing advanced technologies for high-density printed circuits, including additive processes, liquid crystal polymer substrates, and zero-discharge manufacturing.

Precision Circuit Technologies to exhibit advanced PCB fabrication and assembly solutions at DesignCon, focusing on prototype to production for high-performance designs.

Participation in the IMAPS event to showcase high-reliability PCB fabrication and advanced manufacturing solutions for microelectronics and advanced packaging.

Attendance at the Government Microcircuit Applications & Critical Technology Conference, focused on microelectronics and technical collaboration.

Showcasing advanced interconnect solutions, high-layer-count multilayers, and HDI design support for high-reliability PCB fabrication.

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