nanoSkunkWorkX (nSWX)
nanoSkunkWorkX develops engineered thin-material interfaces and a low-temperature electrochemical nanofabrication process to change how heat, current, charge, ions, gases, biomolecules, and signals cross material boundaries. The group develops interface solutions intended for integration into existing manufacturing flows, with initial commercial focus on improving copper conductor interfaces inside advanced semiconductor packages and parallel application workstreams in hydrogen electrodes and portable molecular diagnostics.
Industries
Nr. of Employees
small (1-50)
nanoSkunkWorkX (nSWX)
Products
Conductive thin-interface for package-level copper connections
Nanostructured conductive interface applied to selected copper routes to reduce electrical loss and improve lateral thermal transport in conductor tests; intended for integration into advanced package redistribution and interposer structures.
Porous catalytic electrode interface for hydrogen systems
Porous, high-surface-area catalytic scaffold designed to support charge transfer, electrolyte access, and gas release, reducing charge-transfer resistance and increasing hydrogen production rates under lab-stack conditions.
Transduction surfaces for portable molecular diagnostics
Sensing surfaces that transduce molecular binding into electrical signals for field-deployable diagnostic devices; demonstrated in panel-specific joint R&D work with external partners.
Conductive thin-interface for package-level copper connections
Nanostructured conductive interface applied to selected copper routes to reduce electrical loss and improve lateral thermal transport in conductor tests; intended for integration into advanced package redistribution and interposer structures.
Porous catalytic electrode interface for hydrogen systems
Porous, high-surface-area catalytic scaffold designed to support charge transfer, electrolyte access, and gas release, reducing charge-transfer resistance and increasing hydrogen production rates under lab-stack conditions.
Transduction surfaces for portable molecular diagnostics
Sensing surfaces that transduce molecular binding into electrical signals for field-deployable diagnostic devices; demonstrated in panel-specific joint R&D work with external partners.
Services
Collaborative programmes to define system baselines, run representative tests on customer-relevant structures, and produce go/no-go evidence for integration decisions.
Process development to deposit and pattern nanostructured interfaces on wafer formats, including larger-wafer process windows and pilot production runs.
Collaborative programmes to define system baselines, run representative tests on customer-relevant structures, and produce go/no-go evidence for integration decisions.
Process development to deposit and pattern nanostructured interfaces on wafer formats, including larger-wafer process windows and pilot production runs.
Expertise Areas
- Interface engineering for thermal and electrical transport
- Electrochemical nanofabrication
- Semiconductor advanced packaging integration
- Electrode and catalyst interface development for hydrogen
Key Technologies
- Graphene-enabled conductive interfaces
- Electrodeposition-based thin-film fabrication
- Wafer-scale thin-film patterning
- Electrochemical low-temperature deposition processes
News & Updates
Seed financing to accelerate qualification of interface-engineering technology for advanced packaging and expand industrial development capacity.
Selection for a semiconductor startup programme providing structured routes to validation, qualification, and partner access.
Research poster reporting panel-specific transduction results from a field-deployable biosensor platform developed in joint R&D.
Peer-reviewed paper reporting lower electrical loss, >2× effective in-plane thermal conductivity in comparative film models, and sub-10 nm RMS surface roughness under stated conditions.
Investment to scale the platform and nSD composite products across semiconductors, clean energy, and biosensors.
Awarded Grand Winner at a national deeptech showcase, representing Malaysia for the Asia Finals.
Seed financing to accelerate qualification of interface-engineering technology for advanced packaging and expand industrial development capacity.
Selection for a semiconductor startup programme providing structured routes to validation, qualification, and partner access.
Research poster reporting panel-specific transduction results from a field-deployable biosensor platform developed in joint R&D.
Peer-reviewed paper reporting lower electrical loss, >2× effective in-plane thermal conductivity in comparative film models, and sub-10 nm RMS surface roughness under stated conditions.
Investment to scale the platform and nSD composite products across semiconductors, clean energy, and biosensors.
Awarded Grand Winner at a national deeptech showcase, representing Malaysia for the Asia Finals.