Georgia Tech Research Corporation and Georgia Tech Applied Research Corporation

High-sensitivity differential scanning calorimeter for measuring biomolecular stability.

Isothermal titration calorimeter for measuring molecular interactions and binding affinity.

Microfluidics-based platform for sizing, quantification, and quality control of biomolecules.

Advanced high-resolution micro-CT scanner for small specimen analysis.

High-resolution micro-CT scanner for small biological specimens.

This system of furnaces is ideal for researchers needing to use precise thermal processing for annealing, doping, and oxidizing of wafers.

Conducts applied research, development, test and evaluation (RDT&E) of ground-based air and missile defense (GBAMD) and rotary-wing aviation systems.

An active machine shop providing design, fabrication, assembly, repair, and modification of individual parts or entire mechanical devices for research projects, defense engineering, and external customers.

Course covering basic analytical methods and strategies for reading and plotting data, focusing on Electromagnetic Warfare (EW) challenges.

Digital Infrared Seeker and Missile Simulation/Georgia Tech Synthetic Imaging simulations family of IR missile and systems models.

An Office of Naval Research sponsored laboratory facility providing collaborative research, education, rapid prototyping, and testing for autonomous systems and unmanned vehicles across sea, air, and ground platforms.

Course covering inertial stabilization, pointing, and tracking systems designed to control the line-of-sight of sensors, weapons, and payloads.

Course providing an understanding of concepts related to the collection and analysis of radar signals, system architectures, and tactical actions.

Shared user cleanroom space totaling more than 23,000 square feet used for electronics, MEMS, photonics, and materials research.

Course focusing on the process of automatically filtering, aggregating, and extracting desired information from multiple sensors and sources.

Facility providing training and support on the use of mechanical test systems and accessories.

Introductory course covering the basics of electro-optical/infrared systems (EO-IR) sensor and system design across various applications.

Course covering components required to build optical, electro-optical and infrared hardware into real-world components.

Automated probe system allowing access to the full range of test instruments for wafers as large as 200mm.

A CMOS-compatible tool designed specifically for integrated MEMS-CMOS processes, focused on high aspect-ratio trench etching in silicon and SOI wafers.

Infrastructure combining silicon wafer processing suites and advanced substrate assembly labs for heterogeneous integration, AI, and high-performance computing.

Photoresist spinner and curing ovens for lithography support.

An industry-first demonstrated, fully integrated piezoelectric standalone frequency comb microelectromechanical system (MEMS) innovation used in MEMS frequency synthesizers for precision time metrology, molecular spectroscopy, and wavelength multiplexing.

Digital Image Correlation System capable of non-contact 2D strain measurements.

Non-invasive optical thermo-reflectance system utilized for ultra-fast measurement of temperature distribution of electronic materials and devices.

Core facility for materials analysis offering access to the latest in imaging and analysis technology and tools.

This system enables the inspection of interfaces between dissimilar materials within a substrate. It is commonly used to detect and characterize air voids at the interface between a silicon chip and underfill. Samples are submerged in water during scanning.

Programmable spin coater tool designed for the application of liquid materials on substrates for thin-film deposition applications.

Large-board BGA and surface-mount device rework system with high-accuracy pick-and-place support.

AET Rapid Thermal Processing system.

Electron Cyclotron Resonance plasma deposition system capable of depositing diamond-like films and fluorinated diamond-like films.

An OPTEC WS-Flex USP system that uses a femtosecond laser to process practically any material through ultra-short laser pulses photo-ablation.

Surface display technology services and products available through the core.

Manual wirebonding system supporting aluminum wedge and gold ball bonding modes.

Facility focusing on applications of lasers and plasmas to problems in energy, transportation, security, and measurement.

Spin coater designed for semiconductors and microelectronics applications with precision coating and edge bead removal.

Semiconductor characterization system providing I-V, pulsed I-V and C-V characterization of semiconductor devices and test structures.

Uniaxial servo-hydraulic material testing system supporting axial and torsion configurations.

Semi-automatic flip-chip bonding system featuring larger substrate support and software-controlled force ramping.

Wafer bonding system engineered for temporary and permanent wafer bonding workflows and advanced process integration.

The Schmid APCVD system is well suited for low-cost high-volume processing for all cell architectures requiring single or multi-layer dielectric thin film deposition.

Mask and bond aligner from SUSS MicroTec designed for research, development, and small-scale production.

The Georgia Tech AJA Nitride Multisource Sputtering System deposits thin metal and nitride films in argon and nitrogen-enriched low vacuum.

Versatile thin film deposition system capable of sequential sputtering of up to four materials without breaking vacuum.

Translational center for developing advanced manufacturing tools alongside optical and chemical analysis tools.

A versatile single-chamber inductively coupled plasma system optimized for shallow silicon and dielectric etching.

Thermal evaporation system used for thin film deposition of metals and materials.

RF sputtering system designed for depositing dielectrics and co-deposition with simultaneous material sputtering.

Plasma-Therm Reactive Ion Etching system.

Zeta potential and particle size analyzer using dynamic and electrophoretic light scattering.

RF sputtering system from CVC for thin film deposition.

Plasma-Therm SLR Reactive Ion Etching system.

E-beam evaporation system designed specifically for depositing dielectric materials with direct-to-pocket O2 delivery.

Dual-system E-beam and filament evaporator used for coating samples with various metals.

A silicon DRIE system offering Bosch switched processing and non-switched etching for tapered profiles, wafer thinning, and via reveal.

Proprietary AltaSpray coating tool designed to produce highly uniform resist films on different 3-D microstructures for wafers up to 8 inches.

Proprietary AltaSpray coating tool designed to produce highly uniform resist films on different 3-D microstructures for wafers up to 4 inches.

Electron beam lithography system with 10 nm resolution.

Mask aligner system from Optical Associates, Inc.

Molecular printing and surface patterning system.

Drawer desktop system designed for lead-free and leaded solder reflow processing in standard air atmosphere.

Plasma-Therm Plasma-Enhanced Chemical Vapor Deposition system.

Solitec developer and Specialty Coating Systems spin coater combination for lithography processing.

This Chemcut tool is ideal for researchers needing to use differential etching of a copper seed layer, taking up to 16” panels with oscillating nozzles on both sides.

E-beam evaporation system designed for depositing metals with high precision anisotropic coating.

Dynamic light scattering instrument for measuring nanoparticle and macromolecule size.

A small, precise electronic preheating tool used to warm circuit boards during soldering.

Gas chromatography single quadrupole mass spectrometer for chemical and metabolomic analysis.

Oxford ICP-PECVD systems are used for depositing high-quality dielectric films at low temperatures with low damage, utilizing high-density plasmas.

Spin coater designed for the application of liquid coating materials onto substrates up to 8 inches in diameter with Edge Bead Removal.

Plasma-Therm Inductively Coupled Plasma system for etching or deposition.

MALDI-TOF mass spectrometer designed for high-throughput tissue imaging and biomolecule analysis.

Microelectrode array system for label-free real-time measurement of cellular electrophysiology and impedance.

Versatile system designed to coat samples with various metals using a multi-gun setup and rotostrate.

Electron-beam evaporation system from CVC.

High exposure speed maskless aligner that accommodates various sizes and shapes with flexible pattern changes.

A versatile and reliable Reactive Ion Etcher system designed for etching dielectric materials and shallow silicon.

A maskless lithography system designed for easy operation to develop photoresist films, streamlining prototyping cycles with high optical quality and precision.

Six-pocket E-beam evaporator system used for high-precision thin film depositions of metals and dielectrics.

The Plasma-Therm Versaline high density plasma chemical vapor deposition system uses an inductively coupled plasma to remotely ionize deposition molecules at high power away from the substrate.

System for measuring particle size, molecular weight, and zeta potential.

In vivo optical and CT imaging system for small animal research.

Rapid separation liquid chromatography system for high-performance LC applications.

Low pressure chemical vapor deposition system for polysilicon processing.

Multi-detector module for GPC/SEC analysis of polymers and proteins.

Low pressure chemical vapor deposition system for nitride processing.

A high-density inductively coupled plasma etcher with dual chambers providing flexibility for various etching processes.

In-house synthesis of mg quantities of RNA and DNA oligos with or without modifications.

Physiological monitoring and gating system for small animal MRI and imaging.

High-speed, ultra-high-precision thermal field emission (TFE) electron beam lithography system designed for advanced nanofabrication.

Handheld portable real-time DNA and RNA sequencer.

Automated electrophoresis system for quality control of DNA, RNA, and protein samples.

A digitizer used for acquiring physiological data in research rigs.

Mass cytometry system utilizing ICP-MS technology for deep single-cell and tissue imaging analysis.

Single-cell partitioning instrument for high-throughput single-cell genomics and transcriptomics.

Gel permeation chromatography system for molecular weight and size characterization.

An electronic soldering station used for soldering components onto circuit boards.