Field Viewers, Inc.
Field Viewers is dedicated to revolutionizing the market of radiation detectors for various applications including research, medical imaging, homeland security, and industrial sectors. The company focuses on deploying state-of-the-art hardware and software technologies to provide measurement solutions that exceed customer expectations.
Industries
N/A
Nr. of Employees
small (1-50)
Field Viewers, Inc.
1605 Dungan Ln, Austin TX 78754, USA
Products
Multi-channel multiplexed readout ASIC (approx. 130 channels)
ASIC configured for ~130 input channels with multiplexed readout (example listing indicates ~130:1 multiplexing ratio). Intended for detector readout applications.
32-channel readout ASIC
ASIC implementation with 32 readout channels for detector front-end applications.
64-channel readout ASIC
ASIC implementation with 64 readout channels for detector front-end applications.
Multi-channel multiplexed readout ASIC (approx. 130 channels)
ASIC configured for ~130 input channels with multiplexed readout (example listing indicates ~130:1 multiplexing ratio). Intended for detector readout applications.
32-channel readout ASIC
ASIC implementation with 32 readout channels for detector front-end applications.
64-channel readout ASIC
ASIC implementation with 64 readout channels for detector front-end applications.
Services
Design of mixed-signal and digital ASICs for radiation detection front-ends and associated front-end electronics.
SiP architecture design, substrate selection with embedded passives, and package-level electrical/thermal optimization.
Assembly services including fine-pitch wire bonding, flip-chip, die stacking, auto-molding and class 1000 cleanroom assembly workflows.
CAD-based simulation services for parasitic optimization, EMI/crosstalk mitigation and thermal management at package and substrate levels.
Design and production of test equipment and calibration services for electronic systems and assemblies.
Lifecycle management services including component obsolescence mitigation and redesign of legacy electronics for continued field operation.
Design of mixed-signal and digital ASICs for radiation detection front-ends and associated front-end electronics.
SiP architecture design, substrate selection with embedded passives, and package-level electrical/thermal optimization.
Assembly services including fine-pitch wire bonding, flip-chip, die stacking, auto-molding and class 1000 cleanroom assembly workflows.
CAD-based simulation services for parasitic optimization, EMI/crosstalk mitigation and thermal management at package and substrate levels.
Design and production of test equipment and calibration services for electronic systems and assemblies.
Lifecycle management services including component obsolescence mitigation and redesign of legacy electronics for continued field operation.
Expertise Areas
- Radiation detection and measurement
- ASIC design for multi-channel detector readout
- System-in-Package (SiP) design and manufacturing
- Advanced IC packaging and assembly
Key Technologies
- System-in-Package (SiP)
- Chip-scale packaging (CSP)
- Multi-chip module (MCM-BGA)
- Low-temperature co-fired ceramic (LTCC) substrates