Counterfeit microelectronics detection based on capacitive and inductive signatures
Inventors
Hamilton, Brett J. • Howard, Andrew M.
Assignees
Publication Number
US-9959430-B2
Publication Date
2018-05-01
Expiration Date
2035-02-05
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Abstract
Systems and methods for detecting counterfeit integrated circuits are provided. One exemplary embodiment of a method can include: providing an integrated circuit for testing; and characterizing capacitive and inductive loading of the integrated circuit power for a specified frequency range; wherein the characterizing step further comprises applying a low level alternating current to a power pin while measuring for capacitance characterization conditions created by the integrated circuit's internal capacitance and inductance responses, wherein by sweeping the alternating current signal across a specified frequency range one or more capacitance related device signature can be created and used to identify a component as originating from a trusted source or not. A system can include components and machine readable instructions for operating the components using exemplary methods. Exemplary embodiments can include automated systems that can also be used with the device signature on a production line or in a supply chain verification location.
Core Innovation
The invention relates to systems and methods for detecting counterfeit integrated circuits (ICs) by characterizing capacitive and inductive loading of the integrated circuit power pin over a specified frequency range. The method involves applying a low-level alternating current to a power pin and measuring capacitance and inductance responses as the frequency is swept across the range, creating a device signature that can identify whether a component originates from a trusted source. This approach can be implemented using a precision impedance analyzer and can be automated for use in production lines or supply chain verification.
The problem addressed by the invention arises from existing IC testing methods which are often labor-intensive, costly, time-consuming, and limited in effectiveness. Current methods, such as full electrical specification testing or input/output pin current-to-voltage curve comparison, may fail to detect die substitution counterfeits that meet manufacturer specifications, and are not sufficiently comprehensive. Existing approaches focusing on physical characteristics or material compositions are ineffective for enclosed dies, and rapid, reliable screening methods applicable to older or out-of-production devices are lacking.
The present invention overcomes these limitations by utilizing power pin based capacitive and inductive signature characterization, which exploits subtle manufacturing differences between dies from different foundries. The method provides a major shift in counterfeit IC screening paradigms by offering a rapid, cost-effective, and sensitive technique that can distinguish counterfeit, defective, or suspect microelectronics from legitimate components even when physical and basic electrical tests fail. This includes detection of die substitutions, remarked, salvaged, aged, damaged, or unauthorized modified devices passed off as new or original.
Claims Coverage
The patent claims cover several inventive features centered on a method for detecting counterfeit integrated circuits by analyzing capacitive and inductive characteristics of the IC power pins over frequency sweeps.
Characterization of capacitive and inductive loading by frequency sweep
Applying a low level alternating current to the power pin of an integrated circuit and sweeping or incrementally adjusting the alternating current signal across a specified frequency range to characterize capacitive and inductive loading and generate capacitance data at each frequency.
Creation and use of device signature based on capacitance characterizations
Determining specific capacitance characteristics such as resonance transitions (change from negative to positive capacitance) or capacitance curve segments with slopes closest to zero, and creating device signature data comprising capacitance values associated with these features for identification of legitimate devices.
Comparison of second device signatures with known device signatures for counterfeit detection
Applying electrical signals to the power pin of a second device under test at frequencies associated with device signature data, measuring capacitance, and comparing the measured data with known device signatures to determine match or no match for counterfeit detection.
Use of fixtures and digital read-out for testing and output
Testing integrated circuits in fixtures that removably receive the devices and outputting the comparison results as a digital read-out or on a recording/display medium to indicate if the device is acceptable or counterfeit.
The claims collectively cover a detailed method and system for detecting counterfeit integrated circuits by generating device specific capacitive and inductive signatures through frequency swept impedance measurements on power pins, creating device signatures from characteristic capacitance features, and comparing these signatures to identify counterfeit or unauthorized devices, implemented with suitable test fixtures and output mechanisms.
Stated Advantages
Easier and more cost-effective implementation than full specification based electrical tests.
Rapid execution which is significantly faster than conventional testing methods.
High effectiveness in distinguishing counterfeit ICs, including subtle die substitutions and devices that meet manufacturer electrical specifications.
Ability to detect counterfeits that are physically indistinguishable and difficult to find by visual or existing electrical tests.
Capability to identify devices from unauthorized manufacturers, remarked, salvaged, aged, damaged, or modified parts that are misrepresented as new or original equipment.
Documented Applications
Screening and verification of integrated circuits on production lines.
Use in supply chain verification locations to detect counterfeit or suspect microelectronics.
Testing of older or out-of-production integrated circuit devices where golden samples and extensive statistical data may not be available.
Quality control to ensure integrated circuits originate from legitimate foundries or manufacturers.
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