Heating device and biochemical reactor having the same
Inventors
Su, Chen • CHANG, Hsiao-Fen • Li, Pei-Yu • Tsai, Yun-Lung • Lin, Ching-Ko • Cheng, Wen-hao • CHOU, Pin-Hsing
Assignees
Interested in licensing this patent?
MTEC can help explore whether this patent might be available for licensing for your application.
Publication Number
US-9907117-B2
Publication Date
2018-02-27
Expiration Date
Abstract
The present disclosure relates to a heating device and a biochemical reactor having the heating device. The heating device includes an upper plate, a lower plate, a middle plate, and an electric heating element. The upper plate has an upper heating hole, an upper receiving hole, and an upper conductive layer. The lower plate has a lower heating hole, a lower receiving hole, and a first lower conductive layer. The middle plate is disposed between the upper and lower plates and has a middle heating hole and a middle receiving hole. The upper, middle and lower receiving holes are connected together to form a receiving through hole. The electric heating element is disposed in the receiving through hole and has two terminals connected to the upper conductive layer and the lower conductive layer, respectively.
Core Innovation
The invention provides a heating device formed by stacked upper plate, middle plate, and lower plate, where the upper plate includes an upper heating hole and at least one upper receiving hole adjacent to the upper heating hole, and the lower plate includes a lower heating hole and at least one lower receiving hole adjacent to the lower heating hole. A middle plate is disposed between the upper plate and the lower plate and includes a middle heating hole and at least one middle receiving hole adjacent to the middle heating hole, with conductive layers surrounding the receiving holes and including receiving tube regions connected to the respective regions.
The upper heating hole, the middle heating hole, and the lower heating hole are connected together to form a heating through hole, and the upper receiving hole, the middle receiving hole, and the lower receiving hole are connected together to form a receiving through hole. An electric heating element is disposed in the receiving through hole, and the electric heating element has two terminals connected electrically to the upper conductive layer and the first lower conductive layer, respectively.
The stacked-plate through-hole structure is integrated with a biochemical reactor by aligning through holes in a first body and a second body to connect the holes into a vessel receiving groove. This configuration supports vessel insertion while using the heating device as part of the reactor structure.
Claims Coverage
The independent claim set contains 1 independent claim (clm-00001). The inventive coverage centers on a stacked upper/middle/lower-plate heating-through-hole and receiving-through-hole configuration with an electric heating element disposed in the receiving-through-hole and terminals electrically connected to corresponding conductive layers.
Stacked upper/middle/lower plates forming a heating through hole and a receiving through hole
The heating device has an upper plate with an upper heating hole and at least one upper receiving hole adjacent to the upper heating hole, a middle plate disposed between the upper plate and the lower plate and including a middle heating hole and at least one middle receiving hole adjacent to the middle heating hole, and a lower plate with a lower heating hole and at least one lower receiving hole adjacent to the lower heating hole; the heating holes are connected together to form a heating through hole, and the receiving holes are connected together to form a receiving through hole.
Electric heating element disposed in the receiving through hole with terminals connected to upper and lower conductive layers
An electric heating element is disposed in the receiving through hole and has two terminals connected electrically to the upper conductive layer and the first lower conductive layer, respectively.
Conductive layers with receiving tube regions connected to conductive regions around receiving holes
Conductive layers surround the receiving holes and include receiving tube regions connected to the upper region and lower region.
Overall, the independent claim coverage is defined by aligned heating through holes and aligned receiving through holes through an upper/middle/lower stacked plate structure, with an electric heating element disposed in the receiving through hole and electrically connected to the upper conductive layer and the first lower conductive layer.
Stated Advantages
Reduced solder joint cracking by using plate/through-groove/partition elasticity in the heater structure.
Improved production yield by preventing molten tin solder short-circuit between heater terminals.
Homogeneous heating for vessel temperature control.
Documented Applications
Integration into a biochemical reactor by aligning through holes in a first body and a second body so that the heating device connects the holes into a vessel receiving groove for insertion of a vessel.
Interested in licensing this patent?