Integrated circuit with electromagnetic energy anomaly detection and processing
Inventors
Keller, III, Walter J • PATHAK, BOGDAN A.
Assignees
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Publication Number
US-9887721-B2
Publication Date
2018-02-06
Expiration Date
Abstract
An integrated circuit includes an antenna, a die manufactured from a semiconducting material, an RF energy collection and processing means disposed on or within said die and including at least a receiver and a processing means, an input configured to supply power to said RF energy collection and processing means and an output for operative communication by said RF energy collection and processing means. The integrated circuit is configurable and operable to provide at least one of electromagnetic emission anomaly detection, tamper detection, anti-tamper monitoring, degradation monitoring, health monitoring, counterfeit detection, software changes monitoring, firmware changes monitoring and monitoring of other RF energy anomalies.
Core Innovation
The invention describes an integrated circuit that includes an antenna and an RF energy collection and processing apparatus integrated into a die and coupled to the antenna. The RF energy collection and processing apparatus includes emission detection apparatus receiving spectral emission(s) of RF energy emitted external to the integrated circuit, and operates to sense signatures of the received RF energy emission(s) when the device is supplied with a power signal and/or an oscillating signal.
The invention further provides means for comparing and matching the received RF energy emission(s) to a set of parameters identified for a baseline configuration of a genuine electronic component or genuine electrical device. At least one processor coupled to the emission detection apparatus or receiver processes signature(s) of the received RF energy emission(s) using algorithms operatively associated with the processor to determine state(s) of the electronic component or electrical device attributable to the signature(s) of the received RF energy emission(s).
In the described embodiments, the comparison and matching is based on signature processing of received RF energy emissions and explicit analysis of components of said emissions, including frequency locations, phases, cross-modulation and inter-modulation components, shapes, quality factors, and/or timing characteristics. Additional described processing approaches include discrete wavelet transform (DWT) coefficients and multi-stage comparison procedures that narrow from large-scale comparison to narrowband comparisons and then reduce to a single scalar value to establish a baseline configuration.
Claims Coverage
The document contains two independent claims. Across the claim family, the inventive features include RF emission reception, baseline parameter comparison and matching for genuine configurations, and signature processing to determine state(s), with dependents refining signal processing and hardware/positioning/receiver/antenna configurations.
Integrated RF energy collection and processing in a die coupled to an antenna
An integrated circuit comprising a die manufactured from a semiconducting material, and a radio frequency (RF) energy collection and processing apparatus integrated into said die and coupled to said antenna.
Emission detection of external spectral RF emissions from an energized component
Emission detection apparatus receiving a spectral emission(s) of RF energy emitted, external to said integrated circuit, from said at least one electronic component when said device is supplied with a power signal and/or an oscillating signal; wherein the receiver receives an emission(s) of RF energy emitted external to said integrated circuit from the electrical device when the electrical device is energized with a signal.
Baseline configuration comparison and signature-based state determination
Means for comparing and matching the received RF energy emission(s) to a set of parameters identified for a baseline configuration of a genuine electronic component or genuine electrical device, said means comprising at least one processor coupled to said emission detection apparatus or receiver, and algorithms causing said at least one processor to process signature(s) of said received RF energy emission(s) and determine a state(s) of said at least one electronic component or the electrical device attributable to said signature(s).
Multi-stage comparison to establish a baseline configuration
Processing includes a multi-stage comparison of spectral emissions, comprising large-scale comparison followed by narrowing to narrowband comparisons, and reducing the narrowband results to a single scalar value to establish a baseline configuration.
Discrete wavelet transform coefficient processing for signature comparison
The means causes said at least one processor to calculate discrete wavelet transform (DWT) coefficients and compare and match received RF energy emission signature(s) to genuine electronic component RF emission signature characteristics.
Feature analysis of frequency, phase, modulation components, shape, quality factors, and timing
The at least one processor processes received RF energy emission(s) by examining frequency locations, phases, cross-modulation and inter-modulation components, a shape of said received RF energy emission(s), quality factors, and/or timing characteristics to determine whether the electronic component is genuine or counterfeit.
Receiver noise figure constraints for RF energy collection and processing
The RF energy collection and processing apparatus includes a noise figure at most 5, 1, 0.5, or 0.1 (depending on the stated option).
Selectable antenna types including specified antenna structures
The antenna is selected from one or more antenna types including antenna structures selected from a listed set.
Tip-mounted antenna array with integrated low noise amplifier
A tip-mounted antenna is an antenna array that includes a low noise amplifier (LNA).
Interchangeable tip-mounted antenna array
The tip including the antenna array and the LNA is interchangeable.
RF illumination source with specified modulation/toning forms
An illumination source uses RF energy in one or more forms selected from single-frequency monotonic, multi-tone, or complex modulated to amplify and/or alter characteristics of RF energy radiated by the electrical device and received by the emission detection apparatus.
Successive low-pass and high-pass filtering for decomposition
At least one processor performs successive low-pass and high-pass filtering to decompose received RF energy emission(s).
Configurable positioning using a sensor for standoff distance
A sensor sets a spacing distance between about one micrometer and about one centimeter from the surface of an electrical device.
Overall, the claims coverage centers on die-integrated RF emission sensing via an antenna-coupled RF energy collection and processing apparatus, followed by processor-executed signature processing and comparison/matching to baseline parameters of a genuine component or device to determine state(s). Dependent claim features refine how signatures are compared, what emission features are analyzed, and how the RF front end and sensing arrangement are configured.
Stated Advantages
Enables detection and state determination of an electronic component or electrical device attributable to signatures of received RF energy emission(s).
Supports distinguishing genuine electronic components or devices from counterfeit electronic components using analyzed emission signatures.
Provides an emission-based comparison against a baseline configuration of a genuine component or device.
Documented Applications
Security/quality monitoring by detecting and monitoring electromagnetic emission anomalies, including tampering detection (including FIB-related die modification), counterfeit introduction, degradation/aging, and software/firmware changes.
Device inspection using antenna-based RF emission detection and signature matching to baseline genuine-device parameters to output a genuine-vs-counterfeit or anomaly state.
Health monitoring by detecting degradation/aging and related state determinations via emission signatures.
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