Slot and memory module for a slot standing interconnect
Inventors
McKenney, Darryl J. • TOOHEY, Daniel • MARIANI, Stephen • GUST, Michael • METHRATTA, Absu • FLEURY, Timothy • IMPERALLI, Steven
Assignees
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Publication Number
US-9128679-B2
Publication Date
2015-09-08
Expiration Date
Abstract
According to exemplary embodiments, a controlled-depth slot extending into a circuit board is provided. The controlled depth slot may be milled, and may comprise ½ radial plated through-holes to generate a solderable “D” interconnect feature. The slot may include interconnect features on one to five sides. According to another exemplary embodiment, a circuit board having a depth-controlled interconnect slot is provided in conjunction with one or more solderable technology modules. The one or more solderable technology modules may include memory devices, power devices such as Point of Load Supplies (POLS), security devices and anti-tamper devices, capacitance devices, and other types of chips such as Field Programmable Gate Arrays (FPGAs). The solderable technology modules may be soldered into the slot to secure the modules in the slot and connect the modules to interconnects on the circuit board.
Core Innovation
The invention provides a circuit board having an internal controlled-depth slot for seating a technology module, where the slot depth extends a portion of a depth of the circuit board without extending through the entirety of the circuit board. The slot includes one or more 1/2 radial interconnect features provided on at least one side of the slot, with each radial interconnect feature having a radius of 0.00295 inches to 0.0061 inches.
In the disclosed configuration, the technology module is seated in the internal slot and connects to the radial interconnect features. The circuit board assembly includes an internal slot with radial interconnect features and a module provided in the slot, where the module comprises 200 to 300 solderable fingers that connect with the radial interconnect features. The radial interconnect features and the solderable fingers form solder joints to secure the module within the recess.
The described approach addresses fretting and vibration-related issues that can arise with clip-based external slots by placing the module and its solder-joint interface into the PCB internal recess. The disclosure states that internal placement reduces fretting/vibration issues versus clip-based external slots, enabling smaller PCB dimensions, and describes a vibration/shock/solder-fatigue simulation with mapped results indicating effectively infinite solder-joint life.
Claims Coverage
The independent claims cover two complementary aspects: an internal partially-depth slot with 1/2 radial interconnect features, and a circuit board assembly where a module with 200 to 300 solderable fingers is provided in that slot to connect to the radial interconnect features.
Partially-depth internal slot with radial interconnect features
A circuit board comprising a slot for seating a technology module, where the slot depth extends a portion of a depth of the circuit board without extending through the entirety of the circuit board; and one or more 1/2 radial interconnect features provided on at least one side of the slot, wherein each radial interconnect feature has a radius of 0.00295 inches to 0.0061 inches.
Internal-slot module with 200 to 300 solderable fingers connecting to radial interconnect features
A circuit board assembly comprising a circuit board; a slot internal to the circuit board including one or more 1/2 radial interconnect features provided on at least one side of the slot; and a module provided in the slot wherein the module comprises 200 to 300 solderable fingers that connect with the radial interconnect features.
Overall claim coverage includes a partially-depth internal slot defined by slot depth and 1/2 radial interconnect feature radius ranges, and an assembly arrangement where the module includes 200 to 300 solderable fingers that connect to the radial interconnect features within the internal slot.
Stated Advantages
Reduces fretting/vibration issues versus clip-based external slots.
Enables smaller PCB dimensions.
Provides solder-joint life characterized by effectively infinite solder-joint life (with a quantified solder fatigue life on the order of 1.50×10^15 cycles).
Documented Applications
Circuit board and circuit board assembly configurations for seating technology modules, including memory, power devices (POLS), security/anti-tamper devices, capacitance devices, and FPGAs, directly into the internal controlled-depth slot.
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