Apparatus and method for cooling electrical components of a computer
Inventors
Stock, Michael • Campbell, Brenda • Robbins, Jonathan
Assignees
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Publication Number
US-9075581-B2
Publication Date
2015-07-07
Expiration Date
Abstract
A plenum for guiding a flow of cooling air through the interior of a computer is designed to maximize the airflow over those electrical components within the computer which are most sensitive to temperature, and/or which require the greatest amount of cooling. The plenum is designed to be mounted over top of a computer motherboard which includes a plurality of electrical components mounted thereon. One or more apertures are formed in the lower wall of the plenum so that electrical components mounted on the computer motherboard can protrude through the apertures and into the interior of the plenum. The lower surface of the plenum is designed to prevent the flow of cooling air passing through the plenum from escaping through the apertures on the lower wall. Also, upper and lower protrusions on the plenum can extend into the interior of the plenum to concentrate the flow of cooling air onto the electrical components which are protruding through the apertures and into plenum.
Core Innovation
The invention is a plenum for guiding cooling air across electrical components mounted on a printed circuit board. The plenum includes an inlet, an outlet, and first and second apertures in a lower wall so that a central processing module extends upward through the first aperture and at least one memory module extends upward through the second aperture into an interior of the plenum body when the plenum is mounted over the printed circuit board.
Upper wall, lower wall, and sidewalls surround the interior of the plenum body to guide cooling air through the plenum. The interior is arranged to concentrate and increase airflow over targeted components while reducing bypassing, and the plenum body can include protrusions and shaped interior wall features configured to guide the cooling air flow across the electrical components that extend into the interior.
A computer is also provided in which a motherboard is mounted in a housing and a central processor and at least one memory module are mounted on the computer motherboard. The plenum is mounted over the motherboard so that the central processor extends upward through a first aperture into the plenum interior and the at least one memory module extends upward through a second aperture into the plenum interior, with the plenum walls surrounding the interior.
Claims Coverage
The document provides two independent claims: one directed to a cooling-air plenum mounted over a printed circuit board with multiple lower-wall apertures and upward-extending components, and one directed to a computer that incorporates such a plenum over a motherboard in a housing. The dependent claims referenced in the partial content further refine the airflow delivery by adding protrusions, optional detachable throat elements, supplementary fans, and cooling fan controller functionality.
A plenum with lower-wall apertures for central processor and memory modules
A plenum body including an upper wall, a lower wall and sidewalls joining the lower and upper walls; an inlet and an outlet; and first and second apertures in the lower wall, where the first aperture is configured to receive a central processing module and the second aperture is configured to receive at least one memory module, and when mounted over the printed circuit board the central processing module extends upward through the first aperture into an interior of the plenum body and the at least one memory module extends upward through the second aperture and into the interior, with the upper wall, the lower wall and the sidewalls surrounding the interior.
A computer with a plenum-mounted motherboard where processor and memory extend into the plenum interior
A computer comprising a housing; a computer motherboard mounted in the housing with a central processor and at least one memory module mounted on the computer motherboard; and a plenum including a plenum body with an inlet, an outlet, and first and second apertures in a lower wall, where the plenum is mounted over the motherboard such that the central processor extends upward through the first aperture and into an interior of the plenum body and the at least one memory module extends upward through the second aperture and into the interior, and where the upper wall, the lower wall and the sidewalls surround the interior.
Claim coverage centers on a plenum that interfaces a motherboard by using first and second lower-wall apertures so the central processor and memory modules extend upward into a plenum interior, and on a computer that incorporates such a plenum in a housing-mounted configuration. The dependent claims referenced in the partial content further define airflow by adding protrusions and interior airflow guidance features, and by optionally adding a detachable throat portion, supplementary cooling fans, and cooling fan controller functionality.
Stated Advantages
Provides cooling air concentration/increased airflow over selected high-heat/high-sensitivity components.
Helps prevent airflow bypassing.
Enables cooling with higher ambient temperature and lower fan flow.
Reduces the amount of heat dumped to the room.
Documented Applications
Cooling of selected high-heat/high-sensitivity electrical components mounted on a motherboard, including a central processing unit and associated memory modules, using a cooling plenum.
Computer cooling in a housing-mounted configuration where a motherboard with central processor and memory modules extends into a plenum interior for directed cooling-air flow.
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