Layout of power semiconductor contacts on a cooling surface
Inventors
Maschke, Matthias • Schneeweiss, Hartmut • Ulmer, Anja
Assignees
Interested in licensing this patent?
MTEC can help explore whether this patent might be available for licensing for your application.
Publication Number
US-7845994-B2
Publication Date
2010-12-07
Expiration Date
Abstract
An arrangement for contact-connecting at least one electronic component mounted in a housing with connection wires to a cooling surface and a spring element that can be fixed in the housing and has at least one spring arm which presses the component against the cooling surface in a contact-pressure position of the spring element is presented. The arrangement is characterized in that the spring element can be inserted into the housing without touching the component, and the housing is provided with retaining means for the spring element adapted in a manner so that no shear forces are produced in the longitudinal direction of the connection wires when the spring element is mounted.
Core Innovation
The arrangement provides a contact-connecting configuration for at least one electronic component mounted in a housing with connection wires to a cooling surface. A spring element is fixed in the housing and has at least one spring arm which presses the component against the cooling surface in a contact-pressure position. The spring element can be inserted into the housing without touching the component.
The housing includes retaining means for the spring element adapted so that no shear forces are produced in the longitudinal direction of the connection wires when the spring element is mounted. Insertion grooves are arranged so that the spring element can be inserted into the insertion grooves in a first mounting position parallel to the cooling surface without touching the component by being guided in the insertion grooves. Retaining means are formed as latching grooves which retain the spring element in the contact-pressure position.
Insertion grooves and latching grooves are arranged adjoining each other, with a transition region between them formed so that the spring element can be moved from the insertion grooves in the first mounting position into the latching grooves in the contact-pressure position by overcoming a latching spring force F via a pushing movement in a direction perpendicular to the cooling surface. In this contact-pressure position, the spring arm presses the component against the cooling surface for heat dissipation without shear loading along the connection wires.
The document further describes structural aspects of the spring element and the housing cooling surface. The spring element is formed with a support element and multiple parallel spring arms, with angled projections having folded lugs and convex contact regions, including a reinforcing bead. The cooling surface is described as a flat side wall with cooling ribs, and an optional thermally conductive electrical insulation layer can be provided between the power semiconductor and the cooling surface.
Claims Coverage
Independent claim clm-00001 defines a contact-connecting arrangement with four main inventive features: insertion of the spring element into the housing without touching the component, housing retaining means in the form of latching grooves to retain the spring element in a contact-pressure position, insertion grooves and a transition region enabling movement from a first parallel insertion position into the latching grooves by overcoming a latching spring force F via a pushing movement perpendicular to the cooling surface, and retaining means adapted to prevent shear forces in the longitudinal direction of the connection wires when the spring element is mounted.
Spring element insertable without touching the component
A spring element fixed in the housing has at least one spring arm which presses the component against the cooling surface in a contact-pressure position, wherein the spring element can be inserted into the housing without touching the component.
Retaining means preventing longitudinal shear forces in connection wires
Housing retaining means for the spring element are adapted in a manner so that no shear forces are produced in the longitudinal direction of the connection wires when the spring element is mounted, wherein the retaining means are in the form of latching grooves which retain the spring element in the contact-pressure position.
Insertion grooves guiding parallel insertion relative to the cooling surface
Insertion grooves are arranged on the housing in such a way that the spring element can be inserted into the insertion grooves of the housing in a first mounting position parallel to the cooling surface without touching the component by being guided in the insertion grooves.
Transition region enabling perpendicular pushing movement into contact-pressure position
Insertion grooves and latching grooves are arranged adjoining each other, and a transition region between the insertion grooves and the latching grooves is formed in such a way that the spring element can be moved from the insertion grooves in the first mounting position into the latching grooves in the contact-pressure position by overcoming a latching spring force F by means of a pushing movement in a direction perpendicular to the cooling surface.
The claim set focuses on a spring element that is guided by insertion grooves into a first mounting position parallel to the cooling surface without touching the component, then moved via a transition region into latching grooves into a contact-pressure position by overcoming a latching spring force F through a perpendicular pushing movement, while retaining means are adapted to avoid shear forces in the longitudinal direction of the connection wires.
Stated Advantages
Prevents shear forces in the longitudinal direction of the connection wires when the spring element is mounted.
Provides contact-pressure by pressing the component against the cooling surface for reliable heat dissipation without the need for additional fasteners as described in the summary provided.
Documented Applications
Contact-connecting a power semiconductor mounted in a housing with connection wires to a cooling surface, for heat dissipation in an electronics housing application context described in the document.
Interested in licensing this patent?