Blunt force sensor array
Inventors
Gienger, IV, Edwin B. • Helder, John B. • Trexler, Morgana M. • Carneal, Catherine M. • Dohopolski, Christopher J. • Gurganus, James C. • Mermagen, William H. • Horsmon, Michael S.
Interested in licensing this patent?
MTEC can help explore whether this patent might be available for licensing for your application.
Assignees
MemberJohns Hopkins UniversityJohns Hopkins UniversityFounded in 1876, Johns Hopkins University is recognized as the first research university in the United States. It advances interdisciplinary education, high-impact research, and global outreach, supporting knowledge translation, technological innovation, and community partnerships. The university fosters academic excellence, innovation incubation, outreach, and inclusion across multiple campuses in Baltimore, integrating into the city's social, economic, and cultural life.
Founded in 1876, Johns Hopkins University is recognized as the first research university in the United States. It advances interdisciplinary education, high-impact research, and global outreach, supporting knowledge translation, technological innovation, and community partnerships. The university fosters academic excellence, innovation incubation, outreach, and inclusion across multiple campuses in Baltimore, integrating into the city's social, economic, and cultural life.
Publication Number
US-12642483-B2
Publication Date
2026-06-02
Expiration Date
Abstract
A blunt force sensor array for application to a non-planar surface includes a flexible thin-film substrate, a plurality of force sensors secured to the flexible thin-film substrate proximate to a center measurement point, a strain gauge secured on the flexible thin-film substrate proximate to the center measurement point, and a sensor interface configured to connect to external measurement and control circuitry. The sensor interface may be electrically connected to each of the force sensors and the strain gauge via traces disposed on the flexible thin-film substrate. The flexibility and shape of the flexible thin-film substrate may permit the blunt force sensor array to be applied to the non-planar surface to detect forces and strains experienced by the non-planar surface in response to a blunt force event on the non-planar surface.
Core Innovation
The disclosure describes a blunt force sensor array for subdermal application to a non-planar surface of a bone. The sensor array includes a flexible thin-film substrate comprising independently bendable fingers, and the flexibility and shape permit insertion through an incision in a dermal layer such that each finger and the force sensor or strain gauge secured thereon conform to and are in contact with the non-planar surface of the bone.
The array includes a plurality of force sensors secured proximate to a center measurement point and a strain gauge secured proximate to the center measurement point. At least one of the force sensors or the strain gauge is disposed at a distal end of each independently bendable finger, and each independently bendable finger extends from a common bending region.
The sensor interface is configured to extend through an incision in a dermal layer and externally connect to external measurement and control circuitry, with the sensor interface electrically connected to each of the force sensors and the strain gauge via traces disposed on the flexible thin-film substrate. The sensor interface, the center measurement point, and the common bending region are aligned along a linear relationship, and a first finger extends from the common bending region at a non-perpendicular angle to conform to a curvature of the non-planar surface of the bone and place a peripheral force sensor in contact with the bone.
In a method of subdermally implanting the blunt force sensor array, an incision is made in a dermal layer and a plurality of force sensors and a strain gauge disposed on a thin film substrate are applied subdermally through the incision onto a non-planar surface of a bone. The sensing areas of the central force sensor, a first peripheral force sensor, a second peripheral force sensor, and the strain gauge are disposed in different planes, and the independently bendable fingers permit conforming contact with the non-planar surface to detect forces and strains at respective locations.
Claims Coverage
The independent claims are directed to a blunt force sensor array and a blunt force measurement system, and further to a method of subdermally implanting the sensor array. The core inventive features include independently bendable fingers on a flexible thin-film substrate, force sensors and a strain gauge positioned proximate to a center measurement point with distal placement on finger ends, a sensor interface extending through a dermal incision to external measurement and control circuitry via traces, and conforming contact with a non-planar bone surface.
Independently bendable fingers on a flexible thin-film substrate for subdermal conformity
A flexible thin-film substrate comprising independently bendable fingers, wherein the flexibility and shape of the flexible thin-film substrate and the independently bendable fingers permit the blunt force sensor array to be inserted subdermally through the incision in a dermal layer such that each independently bendable finger and the force sensor or strain gauge secured thereon conform to and are in contact with the non-planar surface of the bone.
Central-proximate force sensors and strain gauge with distal-end placement
A plurality of force sensors secured to the flexible thin-film substrate proximate to a center measurement point and a strain gauge secured on the flexible thin-film substrate proximate to the center measurement point, wherein at least one of the force sensors or the strain gauge is disposed at a distal end of each independently bendable finger.
Sensor interface through dermal incision with trace-based electrical connection
A sensor interface configured to extend through an incision in a dermal layer to externally connect to external measurement and control circuitry, the sensor interface being electrically connected to each of the force sensors and the strain gauge via traces disposed on the flexible thin-film substrate.
Common bending region with linear alignment and non-perpendicular peripheral placement
Each of the independently bendable fingers extends from a common bending region, wherein the sensor interface, the center measurement point, and the common bending region are aligned along a linear relationship, and wherein the first finger extends from the common bending region at a non-perpendicular angle to the linear relationship to conform to a curvature of the non-planar surface of the bone and place a peripheral force sensor secured at a distal end of the first finger in contact with the bone.
External circuitry converts sensor signals into force and strain measurements
Measurement and control circuitry disposed external to the test subject and configured to interface with the blunt force sensor array to convert signals provided by the blunt force sensor array into force and strain measurements.
Different planes sensing areas during subdermal application
Sensing areas of the central force sensor, a first peripheral force sensor, a second peripheral force sensor, and the strain gauge are disposed in different planes when the plurality of force sensors and the strain gauge are applied subdermally through the incision onto the non-planar surface of a bone.
The independent claims collectively cover a flexible thin-film blunt force sensor array with independently bendable fingers that conform to a non-planar bone surface for contact-based sensing, force sensors and a strain gauge positioned proximate to a center measurement point with distal-end placement on finger ends, a sensor interface extending through a dermal incision and electrically connected to sensors via traces, finger layout from a common bending region with linear alignment and non-perpendicular peripheral placement, external measurement and control circuitry that converts sensor signals into force and strain measurements, and a method in which sensing areas are disposed in different planes.
Stated Advantages
Not explicitly described in patent.
Documented Applications
Not explicitly described in patent.
Interested in licensing this patent?