Techniques for manufacturing a wearable ring device
Inventors
Haverinen, Teemu Juhani • Kanniainen, Kari Kuisma • Uusitalo, Marko • Huopana, Jouni Juhani
Assignees
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Publication Number
US-12611806-B2
Publication Date
2026-04-28
Expiration Date
Abstract
Methods, systems, and devices for manufacturing a wearable ring device are described. A printed circuit board (PCB) may be connected to an inner cover, where one or more apertures of the inner cover are aligned with one or more sensors of the PCB. Additionally, an injection molding process may be performed to fill a cavity between the inner cover and a surface of one or more molds with a filler material. The filler material may bind the PCB to the inner cover and fill the one or more apertures with the filler material, creating a ring assembly. Following the injection molding process, an outer cover may be placed around the ring assembly and one or more side covers may engage to secure the inner cover to the outer cover.
Core Innovation
The invention relates to a method for manufacturing a wearable ring device by coupling a printed circuit board (PCB) to an inner ring-shaped housing that includes one or more apertures. Coupling the PCB comprises aligning a plurality of sensors of the PCB with the one or more apertures so that the sensors are positioned with respect to the apertures in the inner ring-shaped housing.
An injection molding process fills a cavity between the inner ring-shaped housing and a surface of a mold with a filler material configured to bind the PCB to the inner ring-shaped housing. The injection molding process includes filling at least a portion of the one or more apertures with the filler material, so that molded filler structures are formed at the aperture locations.
After completion of the injection molding process, the method couples an outer ring-shaped housing to the inner ring-shaped housing, the filler material, or both. The inner curved surface of the outer ring-shaped housing at least partially surrounds an outer curved surface of the filler material following the injection molding process, forming a watertight ring engine assembly by combining the molded filler and the inner and outer ring-shaped housings.
Claims Coverage
The independent claim covers a manufacturing method with three main inventive features: aligning PCB sensors with apertures of an inner ring-shaped housing, injection molding a filler material that binds the PCB and fills at least a portion of the apertures, and coupling an outer ring-shaped housing whose inner curved surface at least partially surrounds an outer curved surface of the molded filler.
Aligning PCB sensors with inner ring apertures
Coupling a printed circuit board (PCB) to an inner ring-shaped housing comprising one or more apertures, wherein coupling the PCB comprises aligning a plurality of sensors of the PCB with the one or more apertures.
Injection molding filler to bind PCB and fill apertures
Performing an injection molding process to fill a cavity between the inner ring-shaped housing and a surface of a mold with a filler material, wherein the filler material is configured to bind the PCB to the inner ring-shaped housing, and wherein the injection molding process comprises filling at least a portion of the one or more apertures of the inner ring-shaped housing with the filler material.
Outer ring coupling to surround molded filler surface
Coupling an outer ring-shaped housing to the inner ring-shaped housing, the filler material, or both, wherein an inner curved surface of the outer ring-shaped housing at least partially surrounds an outer curved surface of the filler material following the injection molding process.
Across the claim set provided, the invention centers on a manufacturing sequence in which a PCB is aligned to apertures in an inner ring-shaped housing, a binding filler is injection molded to fill the apertures, and an outer ring-shaped housing is coupled so its inner curved surface surrounds the molded filler surface.
Stated Advantages
Enables transmission of light through the one or more apertures by using a transparent epoxy filler material.
Supports a watertight ring engine assembly by combining the molded filler and the inner and outer ring-shaped housings.
Documented Applications
A wearable ring device that includes PPG system context (reflective/transmissive) and physiological data collection context, where ring system components are operational without the outer cover.
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