Methods for achieving an isolated electrical interface between an anterior surface of a microneedle structure and a posterior surface of a support structure
Inventors
Windmiller, Joshua • McCanna, James Patrick • Tangney, Jared Rylan
Assignees
Interested in licensing this patent?
MTEC can help explore whether this patent might be available for licensing for your application.
Publication Number
US-12605100-B2
Publication Date
2026-04-21
Expiration Date
Abstract
A method for circumscribing an insulating barrier region around a singular conductive microneedle structure or plurality of conductive microneedle structures adhered to a fixed substrate for the purpose of spatially defining a conduit for the routing of an electrical signal from the surface of said microneedle or microneedles to the posterior surface of the substrate is disclosed herein. A microneedle-based electrochemical biosensors structure comprises a substrate, a microneedle biosensor, a primary electrically conductive element, a secondary electrically conductive element and an electrically insulative annular barrier.
Core Innovation
The biosensor has a microneedle extending from a substrate, an electrical contact at the penetrating end, and an electrically insulative barrier surrounding the microneedle. The barrier electrically isolates the microneedle from the substrate. In embodiments with multiple microneedles, each microneedle has a respective electrical contact and an electrically insulative barrier that isolates it from the substrate.
The described arrangement provides a signal path from a sensing contact at the penetrating end to a posterior contact for probing or packaging, without obstructing the skin-facing surface. The substrate may comprise semiconductor or electrically conducting material. The described embodiments also include posterior contacts and connections to a printed circuit board or integrated circuit.
Claims Coverage
The provided claims identify three independent claims: claims 1, 10, and 18. They cover a single-microneedle biosensor with a semiconductor substrate, a multiple-microneedle biosensor with a semiconductor substrate, and a single-microneedle biosensor with an electrically conducting substrate.
Single-microneedle biosensor with an electrically insulative barrier
A semiconductor substrate supports a microneedle with a first portion within the substrate and a second portion extending from its anterior surface. An electrical contact is located on the penetrating end, and an electrically insulative barrier surrounds the first portion and the body of the second portion, electrically isolating the microneedle from the substrate.
Multiple-microneedle biosensor with electrically insulative barriers
A semiconductor substrate supports a plurality of microneedles, each with a first portion within the substrate and a second portion extending from its anterior surface. Each microneedle has an electrical contact on its penetrating end and a respective electrically insulative barrier surrounding its first and second portions, electrically isolating it from the substrate.
Single-microneedle biosensor with an electrically conducting substrate
An electrically conducting substrate supports a microneedle within and extending from the substrate, with an electrical contact on its penetrating end. A barrier surrounds the microneedle within the substrate and along a length of the microneedle extending from the substrate, electrically isolating the microneedle from the substrate.
The three independent claims cover biosensors that electrically isolate one or more microneedles from their substrates while providing electrical contacts at the penetrating ends. The claims distinguish semiconductor-substrate embodiments, including a multiple-microneedle arrangement, from an embodiment with an electrically conducting substrate.
Stated Advantages
The signal path from the sensing contact to a posterior contact supports probing or packaging without obstructing the skin-facing surface.
Documented Applications
An electrochemical sensing element at the electrical contact is configured to detect an analyte.
The biosensor is described with posterior contacts and connections to a printed circuit board or integrated circuit using solder or conductive epoxy.
Interested in licensing this patent?