Image pickup unit having resin in via holes for an endoscope

Inventors

Kobayashi, Keiichi

Assignees

Olympus Corp

Abstract

An image pickup unit includes: an image pickup substrate including a first principal surface and a second principal surface, a light receiving circuit being formed on the first principal surface and a through wiring being placed on an inner surface of a via hole including an opening in the second principal surface; a solder resist film placed around the via hole on the second principal surface and in the via hole in a range from a bottom face to a level not reaching the second principal surface; and a bonding terminal which is made of solder, covers a surface of the solder resist film placed in the via hole, and is bonded to the through wiring on an outer edge of the opening in the via hole, the through wiring being not covered with the solder resist film.

Core Innovation

The invention provides a semiconductor apparatus in which a semiconductor circuit is formed on a first principal surface of a semiconductor substrate and through wiring electrically continuous with the semiconductor circuit is placed on an inner surface of a via hole. The via hole includes an opening in a second principal surface opposite the first principal surface, and resin is placed around the via hole on the second principal surface and in the via hole from a bottom face to a level not reaching the second principal surface.

A bonding terminal made of solder covers a surface of the resin placed in the via hole and is bonded to the through wiring on an outer edge of the opening in the via hole. The through wiring is not covered with the resin, and the surface of the resin in the via hole is concave, with the portion of the through wiring not covered with the resin being annular.

The invention is applied as an image pickup unit and is incorporated into an endoscope. The image pickup unit includes a light-receiving circuit formed on the first principal surface, and the endoscope includes the image pickup unit in a distal end portion of an insertion portion.

Claims Coverage

The independent claims include three apparatus or system claims and one manufacturing method claim. The core inventive coverage centers on a semiconductor circuit or light-receiving circuit on a first principal surface, through wiring in a via hole with an opening on the second principal surface, resin placed around and within the via hole to a level not reaching the second principal surface while leaving the through wiring not covered, and a solder bonding terminal that covers the resin surface inside the via hole and bonds to the through wiring at the outer edge of the opening.

Across the independent claims, the coverage is directed to a semiconductor-through-via structure in which resin is limited to a level not reaching the opposite principal surface, the through wiring remains not covered by the resin, and a solder bonding terminal covers the resin surface inside the via hole while bonding to the through wiring at the outer edge of the via opening; the same structure is incorporated into an image pickup unit and an endoscope distal insertion portion, and it is manufactured by forming a via hole to an electrode, placing through wiring, resin coating limited by height, and installing a solder bonding terminal.

Stated Advantages

Documented Applications