Multilayer board, probe unit, and ultrasound endoscope
Inventors
Assignees
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Publication Number
US-12569883-B2
Publication Date
2026-03-10
Expiration Date
Abstract
A multilayer board includes: a front-side layer; an intermediate layer; a back-side layer; the front-side layer; a first ground terminal and a second ground terminal for connecting ground lines of a plurality of shield lines to be connected to the multilayer board; a plurality of signal line connecting terminal arrays each including a plurality of signal line connecting terminals for connecting respective signal lines of the shield lines; and a wire having a thermal conductivity, the wire extending to the second end on the intermediate layer.
Core Innovation
The invention relates to an ultrasound endoscope system that uses a laminated multilayer board having a front-side layer, an intermediate layer, and a back-side layer laminated in a lamination direction. The multilayer board has a first end and a second end in a longitudinal direction, with the first end configured to be electrically connected to an ultrasound transducer on a side of the first end.
A first ground terminal and a second ground terminal are provided for connecting ground lines of a plurality of shield lines to the multilayer board. The first ground terminal and the second ground terminal form a part of the front-side layer and a part of the back-side layer at a side of the second end, respectively, and a plurality of signal line connecting terminal arrays are arranged along the longitudinal direction in the vicinity of the ground terminal.
The disclosed embodiments further describe a wire having a thermal conductivity extending to the second end on the intermediate layer, together with shield lines, vias, and thermal conduction portions between the front-side layer, back-side layer, and intermediate layer. The arrangement addresses assembly-related heat transfer while maintaining terminal placement relative to board edges and wiring patterns across layers.
Claims Coverage
The patent portion provides three independent claims. Across these claims, the inventive structure is a laminated multilayer board with ultrasound-transducer electrical connection at a first end, ground and signal terminal arrays near a second end connected to shield lines, and a wire of thermal conductivity extending to the second end on the intermediate layer.
Laminated multilayer board with ultrasound transducer connection at a first end
A multilayer board having a front-side layer, an intermediate layer, and a back-side layer laminated in a lamination direction, configured with a first end and a second end in a longitudinal direction such that the multilayer board is electrically connected to an ultrasound transducer on a side of the first end.
Ground terminals aligned with front-side and back-side layers at a second end for shield-line ground connections
A first ground terminal and a second ground terminal for connecting ground lines of a plurality of shield lines to be connected to the multilayer board, the first ground terminal and the second ground terminal forming a part of the front-side layer and a part of the back-side layer on a side of the second end, respectively.
Longitudinally arranged signal line connecting terminal arrays near ground terminals
A plurality of signal line connecting terminal arrays each including a plurality of signal line connecting terminals for connecting respective signal lines of the shield lines, the plurality of signal line connecting terminal arrays forming a part of the front-side layer and a part of the back-side layer in a vicinity of the ground terminal in the longitudinal direction, the plurality of signal line connecting terminal arrays being arranged along the longitudinal direction.
Thermally conductive wire extending to the second end on the intermediate layer
A wire having a thermal conductivity, the wire extending to the second end on the intermediate layer.
Probe unit integrating shield lines with the laminated multilayer board
A probe unit comprising a plurality of shield lines, and a multilayer board including a front-side layer, an intermediate layer, and a back-side layer laminated in a lamination direction; the multilayer board configured to be electrically connected to an ultrasound transducer at the first end, with ground terminals, signal line connecting terminal arrays near the ground terminal in the longitudinal direction, and a wire having a thermal conductivity extending to the second end on the intermediate layer.
Ultrasound endoscope integrating ultrasound transducer, shield lines, and the laminated multilayer board
An ultrasound endoscope comprising an ultrasound transducer configured to transmit and receive ultrasound waves, a plurality of shield lines, and a multilayer board including a front-side layer, an intermediate layer, and a back-side layer laminated in a lamination direction; the multilayer board configured to be electrically connected to the ultrasound transducer at the first end, with ground terminals, signal line connecting terminal arrays near the ground terminal in the longitudinal direction, and a wire having a thermal conductivity extending to the second end on the intermediate layer.
Across the independent claims, the claim coverage centers on a laminated multilayer board with front-side, intermediate, and back-side layers; electrical connection to an ultrasound transducer at a first end; ground terminals forming parts of the front-side and back-side layers at a second end for shield-line ground connections; signal line connecting terminal arrays arranged along the longitudinal direction near the ground terminals; and a wire with thermal conductivity extending to the second end on the intermediate layer.
Stated Advantages
Documented Applications
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