Device and method for producing a patch which has a plurality of microstructures
Inventors
Henke, Stefan • Trommer, Hagen • SCHERR, Sebastian
Assignees
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Publication Number
US-12558525-B2
Publication Date
2026-02-24
Expiration Date
Abstract
A device for producing a patch which includes a plurality of microstructures has at least one die. The die is used to produce a microstructure and has a plurality of depressions for this purpose. Additionally, a support layer, which is provided with an adhesive layer, is provided. In a preferred embodiment, it is possible to move the microstructure formed in the die in the direction of the support layer using a lifting device such that said microstructure adheres to the face of the support layer, which is provided with the adhesive layer. For example, by carrying out a corresponding method multiple times, multiple microstructures can be provided on the support layer adjacently to one another. Optionally, multiple dies can also be provided so that multiple microstructures can be simultaneously arranged on the support layer.
Core Innovation
The invention relates to a device for producing a patch which comprises multiple microstructures. The device comprises at least one die with a plurality of depressions for producing a microstructure, and a support layer comprising an adhesive layer. The device further comprises a lifting device having one plunger per each die of the at least one die, where the lifting device is configured to perform relative movement between the die and the support layer such that the microstructure arranged in the die adheres to the support layer.
Each plunger comprises an upper surface resting on a lower surface of its respective die, and the lifting device moves the plunger against the die to create the relative movement between the die and the support layer. A displacement device is provided for horizontally displacing the support layer relative to the at least one die so that multiple microstructures are arranged side-by-side on the support layer. In addition, multiple dies can be provided side-by-side.
In the method aspect, a formulation is metered into depressions of at least one die, and the die is moved relative to a support layer comprising an adhesive layer so that the microstructures adhere. The method further includes displacing the at least one die relative to the support layer and subsequently moving the at least one die again so that microstructures are arranged next to microstructure(s) already adhering. The method also includes pushing at least one plunger into at least one receiving device, where the receiving device is formed as a hollow cylinder, with an upper surface of the plunger resting on a lower surface of the die. Multiple dies can be simultaneously moved relative to the support layer.
Claims Coverage
The document provides two independent claims, one directed to a device and one directed to a method, with at least five main inventive features across these independents.
Die with depressions for producing microstructures
At least one die which comprises a plurality of depressions for producing a microstructure.
Support layer with adhesive layer
A support layer which comprises an adhesive layer.
Lifting device with one plunger per die and relative movement
A lifting device comprising one plunger per each die of the at least one die, configured to move each plunger against each respective die to perform a relative movement between the at least one die and the support layer such that the microstructure arranged in the at least one die adhere to the support layer, with each plunger having an upper surface resting on a lower surface of its respective die.
Horizontal displacement device for side-by-side microstructures
A displacement device for horizontally displacing the support layer relative to the at least one die so that multiple microstructures are arranged side-by-side on the support layer, and/or multiple dies are provided side-by-side.
Metering formulation into die depressions and sequential side-by-side placement
Metering a formulation into depressions of at least one die, moving the at least one die relative to a support layer comprising an adhesive layer, displacing the at least one die relative to the support layer, and subsequently moving the at least one die again so that microstructures are arranged next to microstructure(s) already adhering thereto.
Hollow-cylinder receiving devices for plungers
Pushing at least one plunger into at least one receiving device, wherein the receiving device is formed as a hollow cylinder, such that an upper surface of the plunger rests on a lower surface of the respective die.
Simultaneous movement of multiple dies relative to adhesive support layer
Simultaneously moving multiple dies relative to the support layer comprising the adhesive layer.
Overall, the claims cover producing a patch with multiple microstructures using a die having depressions, a support layer with an adhesive layer, and a lifting device with one plunger per die that performs relative movement to adhere the microstructures. Side-by-side arrangement is achieved by a displacement device for horizontal displacement relative to the die and/or by providing multiple dies side-by-side, and the method includes metering a formulation into die depressions and adhering sequentially or simultaneously, including hollow-cylinder receiving devices for plungers.
Stated Advantages
Documented Applications
No documented applications found
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