Implants for filling bore holes in bone and methods for filling bore holes in bone
Inventors
Åberg, Jonas • Ibrahim, Ghanim • Engstrand, Thomas
Assignees
Interested in licensing this patent?
MTEC can help explore whether this patent might be available for licensing for your application.
Publication Number
US-12508054-B2
Publication Date
2025-12-30
Expiration Date
Abstract
An implant for at least partially filling a bore hole in a bone includes a biocompatible plate and a support structure. The support structure has a ring-shaped inner support frame having an outer surface defining the outer diameter of the inner support frame and an inner surface, and an outer support frame having a plurality of fastening points adapted for attaching the implant to bone surrounding a bore hole in which the plate is inserted. The outer support frame is connected to and extends away from the outer surface of the inner support frame. A method of forming the implant is also provided.
Core Innovation
The invention relates to an implant for at least partially filling a bore hole in a bone, comprising a biocompatible plate and a support structure. The biocompatible plate has an upper surface, a bottom surface, and a central axis, and is encircled by a ring-shaped inner support frame with an exposed outer surface and an inner surface that defines an inner diameter.
At least one support member is connected to and extends inwardly from the inner surface of the ring-shaped member within the plate. At least a portion of the support member extends inwardly from the inner surface at an angle with respect to a plane orthogonal to the central axis, such that the depth of the support member within the plate varies along its length.
Each support member is in the form of a wire loop having first and second connected legs, where the first leg extends inwardly and downwardly away from a first portion of the inner surface and the second leg extends inwardly and downwardly away from a second portion of the inner surface. The implant further includes an outer support frame extending away from the exposed outer surface of the ring-shaped member and having fastening points for attaching the implant to surrounding bone.
Claims Coverage
The partial content identifies a single independent claim defining the implant. The main inventive coverage includes four inventive features: a biocompatible plate with an inner ring-shaped frame; inwardly angled, depth-varying support members; wire-loop leg geometry connected to different portions of the ring’s inner surface; and an outer support frame with fastening points.
Biocompatible plate with inner ring-shaped frame
A biocompatible plate having an upper surface, a bottom surface, and a central axis, with a support structure including an inner support frame comprising a ring-shaped member encircling the plate.
Inwardly angled support members with varying depth
At least one support member connected to and extending inwardly from the inner surface of the ring-shaped member, wherein at least a portion extends inwardly at an angle with respect to a plane orthogonal to the central axis so the depth within the plate varies along its length.
Wire-loop support geometry with first and second legs
Each support member is a wire loop having first and second connected legs, wherein the first leg extends inwardly and downwardly away from a first portion of the inner surface and the second leg extends inwardly and downwardly away from a second portion of the inner surface.
Outer support frame with fastening points
An outer support frame connected to and extending away from the exposed outer surface of the ring-shaped member, the outer support frame including fastening points adapted for attaching the implant to bone surrounding a bore hole.
Independent claim clm-00001 covers a bore-hole filling implant combining a biocompatible plate with an inner ring-shaped frame and an outer fastening frame, and requiring inwardly angled wire-loop support members whose inward extension creates depth variation within the plate.
Stated Advantages
Not explicitly described in patent.
Documented Applications
Not explicitly described in patent.
Interested in licensing this patent?