Process for manufacturing wearable ring form factor
Inventors
Haverinen, Teemu Juhani • Latomäki, Mikko • Mäkinen, Jukka-Tapani • Uusitalo, Marko • Lämsä, Antti
Assignees
Interested in licensing this patent?
MTEC can help explore whether this patent might be available for licensing for your application.
Publication Number
US-12440161-B2
Publication Date
2025-10-14
Expiration Date
Abstract
Methods, systems, and devices for manufacturing a wearable device are described. A method for manufacturing a wearable device may include coupling a printed circuit board (PCB) to an inner ring-shaped housing that contains a plurality of apertures by aligning a plurality of sensors of the PCB with the plurality of apertures. The method may also include coupling an outer ring-shaped housing to the inner ring-shaped housing by surrounding the inner ring-shaped housing with the outer ring-shaped housing. Additionally, the method may include injecting a filler material through an additional aperture of the outer ring-shaped housing to fill a cavity defined by the inner ring-shaped housing and the outer ring-shaped housing, filling at least a portion of the plurality of the inner ring-shaped housing with the filler material.
Core Innovation
The invention relates to a method for manufacturing a wearable ring device in which a printed circuit board is coupled to an inner ring-shaped housing comprising a plurality of apertures. The coupling comprises aligning a plurality of sensors of the printed circuit board with the plurality of apertures of the inner ring-shaped housing. The inner ring-shaped housing comprises a first metallic material, and the structure defines a cavity together with the outer ring-shaped housing.
An outer ring-shaped housing is coupled to the inner ring-shaped housing by at least partially surrounding the inner ring-shaped housing. The outer ring-shaped housing comprises a second metallic material and an additional aperture. Filler material is injected through the additional aperture of the outer ring-shaped housing to fill a cavity defined at least in part by the inner ring-shaped housing and the outer ring-shaped housing with the filler material.
The injected filler material fills at least a portion of the plurality of apertures of the inner ring-shaped housing. The filler material is discussed as a transparent or semi-transparent epoxy to support optical coupling. The described structural effect includes a “comfort dome” inner surface with reduced protrusions and pressure gradients, supported by sealing concepts to reduce stray light.
The manufacturing approach supports customizability and durability through separate inner and outer ring-shaped housings, including exchangeable outer housing concepts. The document further discusses injection through inner or outer apertures using molds and optional flush or polish finishing, including an outer aperture filled with a second metallic material.
Claims Coverage
The provided content includes one independent method claim with multiple dependent claims, focused on sensor-to-aperture alignment during coupling, cavity definition between inner and outer ring-shaped housings, and injection of a filler material through an outer additional aperture to fill inner apertures and support optical coupling and an improved inner surface.
Sensor alignment with inner apertures during PCB coupling
Coupling a printed circuit board to an inner ring-shaped housing comprising a plurality of apertures by aligning a plurality of sensors of the printed circuit board with the plurality of apertures.
Surrounding outer housing with additional aperture and second metallic material
Coupling an outer ring-shaped housing to the inner ring-shaped housing by at least partially surrounding the inner ring-shaped housing, the outer ring-shaped housing comprising a second metallic material and an additional aperture.
Filler injection through outer additional aperture to fill cavity and inner apertures
Injecting a filler material through the additional aperture of the outer ring-shaped housing to fill a cavity defined at least in part by the inner ring-shaped housing and the outer ring-shaped housing, wherein the filler material fills at least a portion of the plurality of apertures of the inner ring-shaped housing.
Transparent epoxy for light transmission through apertures
Filler material includes a transparent epoxy that allows light to pass through the plurality of apertures.
Flush filler filling of inner apertures
Filling all apertures with a filler material so the filler is flush with an inner circumferential surface of the inner ring-shaped housing.
Overfill and polish to achieve flush inner surface
Filling a plurality of apertures with a filler material that extends beyond the inner circumferential surface, and polishing the inner circumferential surface so the filler material becomes flush with that surface.
Locating component engagement for radial sensor alignment
Coupling the printed circuit board to an inner ring-shaped housing by engaging locating components between the housing and the printed circuit board to hold the printed circuit board in a radial orientation and align its sensors with apertures.
Second metallic material filling for outer additional aperture with outer polishing
Filling an additional aperture in an outer ring-shaped housing with a second metallic material and then polishing an outer circumferential surface of the outer ring-shaped housing based on that filling.
The inventive coverage centers on aligning PCB sensors with apertures in an inner ring-shaped housing, surrounding that inner housing with an outer ring-shaped housing having an additional aperture, and injecting filler material through the outer additional aperture to fill the cavity and inner apertures, including variations for transparent epoxy, flush or overfill-and-polish finishing, locating-component alignment, and an outer additional aperture filled with second metallic material.
Stated Advantages
Improved optical coupling supported by transparent or semi-transparent filler material.
Reduced protrusions and reduced pressure gradients via a “comfort dome” inner surface.
Reduced stray light via sealing.
Support for customizability and durability via separate inner and outer ring-shaped housings and exchangeable outer housing concepts.
Durability and manufacturing completion supported by separate housing structure and described injection and finishing concepts.
Documented Applications
Manufacturing and structural configuration of a wearable ring device having optical interfaces and sensors aligned to apertures for physiological data signals including PPG and SpO2 signals.
Interested in licensing this patent?