Method for patterning a substrate, a method for forming a microstructure on a substrate, and a method for fabricating a fluidic device
Inventors
Assignees
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Publication Number
US-12338523-B2
Publication Date
2025-06-24
Expiration Date
Abstract
According to an embodiment of the present disclosure, a method for patterning a substrate is provided. In some embodiments, the method includes patterning a hydrophobic film formed on a surface of a substrate, applying a target material, and oxidizing at least the surface of the applied target material. In some embodiments, the method further includes removing the hydrophobic film from the substrate.
Core Innovation
The invention provides a method for patterning a target material over a substrate by forming and patterning a hydrophobic film so that selected portions of the substrate surface are exposed. A target material is applied to the exposed portions such that the hydrophobic film is exposed at other portions, and the exposed target material is then oxidized before a microstructure is formed on a surface of the oxidized target material.
After microstructure formation, the hydrophobic film is removed so that microstructures remain on the patterned target regions. The hydrophobic film functions to restrict where material is present during fabrication, enabling patterned microstructure formation on the oxidized target material while leaving other regions without the formed microstructures.
The disclosed examples include forming microstructures such as ZnO nanowires on oxidized target material regions, where the hydrophobic film restricts microstructure formation during growth. The document also discusses fabricating fluidic devices that include nanowire microstructures in flow channels and creating clean bonding interfaces on exposed flat substrate regions for fluid-tight sealing.
Claims Coverage
The document contains one independent claim that defines a hydrophobic-film-based patterning method with oxidation and microstructure formation, followed by hydrophobic film removal. The independent claim includes multiple inventive feature refinements in dependent claims, but the core approach is centered on claim 1’s sequence of hydrophobic patterning, target application, oxidation, microstructure formation, and hydrophobic film removal.
Hydrophobic film patterning to expose substrate portions
Forming a hydrophobic film on a surface of the substrate and patterning the hydrophobic film to expose a portion of the surface of the substrate while keeping other portions covered by the hydrophobic film.
Target material application with hydrophobic film exposed elsewhere
Applying a target material to the portion of the surface of the substrate exposed by the patterning such that the hydrophobic film is exposed at another portion of the surface of the substrate.
Oxidizing target material before microstructure formation
Oxidizing the target material on the substrate.
Forming a microstructure on the oxidized target surface
Forming a microstructure on a surface of the oxidized target material before removing the hydrophobic film.
Removing the hydrophobic film after microstructure formation
Removing the hydrophobic film after said forming of the microstructure.
Across the independent claim, the primary inventive concept is a patterned hydrophobic-film workflow that exposes selected substrate regions for applying an oxidizable target, then oxidizes the target and forms a microstructure on the oxidized target surface, with the hydrophobic film removed afterward to leave microstructures only on patterned target regions.
Stated Advantages
Avoids unwanted debris/contamination on regions that are in contact with a cover for fluid-tight sealing.
Documented Applications
Fabrication of fluidic devices with nanowire microstructures in flow channels and clean bonding interfaces to achieve fluid-tight sealing.
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