Image pickup unit, endoscope, and method of manufacturing image pickup unit
Inventors
Assignees
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Publication Number
US-12317629-B2
Publication Date
2025-05-27
Expiration Date
Abstract
An image pickup unit includes a stacked device in a substantially rectangular parallelepiped shape including an external electrode, and a three-dimensional wiring board including a bonding electrode and an alignment mark on a bottom surface of a recess on a first principal surface and a projection, on a side surface, projecting in a first direction parallel to a wall surface of the recess, in which the external electrode of the stacked device that is disposed in the recess is bonded to the bonding electrode, and on the bottom surface, an area of a region in which a first region where the bonding electrode is virtually moved in the first direction and the alignment mark are superposed on each other is less than 50% of an area of the alignment mark.
Core Innovation
The invention relates to an image pickup unit in which a stacked device in a substantially rectangular parallelepiped shape includes a light receiving surface and a back surface on a side opposite to the light receiving surface, and further includes an external electrode on the back surface that outputs an image pickup signal. The stacked device is disposed in a recess of a three-dimensional wiring board, and the external electrode disposed in the recess is bonded to a bonding electrode on a bottom surface of the recess.
The three-dimensional wiring board includes a first principal surface and a side surface orthogonal to the first principal surface, with a projection on the side surface projecting in a first direction parallel to a wall surface of the recess. On the bottom surface, an area of a region in which a first region where the bonding electrode is virtually moved in the first direction and the alignment mark are superposed on each other is less than 50% of an area of the alignment mark.
The same image pickup unit concept is used in an endoscope comprising the image pickup unit, and manufacturing of the image pickup unit is also described by producing three-dimensional wiring boards using injection molding with resin injection via runners respectively extending from the side surfaces and then through irradiation with a laser and film-forming by plating. The boards are cut at the runners into individual pieces, the gate cut projecting in a first direction parallel to a wall surface of the recess is configured to abut on one surface of a jig, positioning is performed using the alignment mark, and the external electrode and the bonding electrode are bonded under the overlap-area condition of less than 50%.
Claims Coverage
The document provides three independent claims: an image pickup unit, an endoscope including that image pickup unit, and a method of manufacturing the image pickup unit. Across these independent claims, there are three principal inventive feature themes: a stacked rectangular-parallelepiped image pickup device with an external electrode on a back surface, a three-dimensional wiring board with a recess containing a bonding electrode and an alignment mark plus a projection defined relative to recess walls, and a quantitative alignment/overlap constraint based on a virtual movement region along a first direction being less than 50% of the alignment mark area.
Stacked device with external electrode outputting an image pickup signal
A stacked device in a substantially rectangular parallelepiped shape including a light receiving surface and a back surface on a side opposite to the light receiving surface; and an external electrode, on the back surface, that outputs an image pickup signal.
Three-dimensional wiring board recess with bonding electrode, alignment mark, and projection
A three-dimensional wiring board including a first principal surface and a side surface orthogonal to the first principal surface; a bonding electrode and an alignment mark on a bottom surface of a recess on the first principal surface; and a projection, on the side surface, projecting in a first direction parallel to a wall surface of the recess.
Less than 50% overlap area between virtually moved bonding region and alignment mark
On the bottom surface, an area of a region in which a first region where the bonding electrode is virtually moved in the first direction and the alignment mark are superposed on each other is less than 50% of an area of the alignment mark.
Endoscope comprising the image pickup unit
An endoscope comprising an image pickup unit that includes the stacked device, the three-dimensional wiring board, the bonding electrode, the alignment mark, and the projection, wherein the external electrode of the stacked device is bonded to the bonding electrode under the overlap-area condition of less than 50%.
Manufacturing using injection-molded 3D wiring boards, laser irradiation and plating, jig-based positioning, and bonding
Producing three-dimensional wiring boards using injection molding in which resin is injected into a mold via runners respectively extending from the side surfaces and then through irradiation with a laser and film-forming by plating; cutting the boards at the runners into individual pieces including a gate cut projecting in a first direction parallel to a wall surface of the recess; causing the gate cut to abut on one surface of a jig; performing positioning between the bonding electrode and an external electrode of a stacked device using the alignment mark with an overlap constraint of less than 50%; and bonding the external electrode and the bonding electrode.
Overall, the claims coverage centers on an image pickup unit and an endoscope using a stacked substantially rectangular parallelepiped image pickup device with an external electrode on the back surface, electrically bonded to a bonding electrode on a three-dimensional wiring board recess. The three-dimensional wiring board includes a projection oriented parallel to recess walls, and both positioning and bonding are governed by a quantitative overlap condition in which the area where a bonding electrode virtual-move region superposes on the alignment mark is less than 50% of the alignment mark area.
Stated Advantages
Not explicitly described in patent.
Documented Applications
Endoscope comprising the image pickup unit.
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