Heat sink system
Inventors
Sahu, Raj • Gurpinar, Emre • Ozpineci, Burak
Assignees
Publication Number
US-12317456-B2
Publication Date
2025-05-27
Expiration Date
2041-10-06
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Abstract
A system and method for generating a heat sink for circuitry, such as a power module, that facilitates removal of heat from the circuitry. To improve power density of power modules, not only electrical but also thermal optimization may be carried out as the two subsystems closely interact with each other.
Core Innovation
The invention provides a heat sink system for extracting heat from circuitry, such as power modules, during their operation. The heat sink includes a solid, thermally conductive material with a first surface configured to be thermally coupled with the circuitry and a second surface opposing the first surface, which is arranged to contact a cooling medium. A cover is arranged to encapsulate the cooling medium between the cover and the second surface, forming channels that direct the medium's flow. The cross-section of the second surface orthogonal to this flow is shaped according to a predetermined linear combination of sinusoidal spatial harmonics, with a total number of terms N satisfying 2≤N≠∞.
The problem addressed by the invention is the insufficient heat removal from power modules utilizing wide-bandgap (WBG) semiconductor devices. Although these devices enhance power conversion efficiency and power density, they create substantial power losses in a compact volume, making effective thermal management critical. Conventional approaches have focused on heat removal but have not adequately solved the problem, limiting the realization of benefits from advanced semiconductor technologies and the reliability required for demanding applications like automotive systems.
The invention utilizes evolutionary algorithms, particularly genetic algorithms, in combination with finite element analysis to optimize heat sink geometry for specific applications. A method based on Fourier analysis is used to represent complex heat sink geometries with a reduced set of parameters, allowing efficient computational optimization. This approach supports multi-objective enhancements, taking into account constraints such as maximum junction temperature, pressure drop, and heat sink volume, and is applicable to traditional as well as additive manufacturing methods.
Additionally, the heat sink system mitigates thermal imbalances by generating a tailored heat sink profile that balances the thermal impedance experienced by individual components of the circuitry. By utilizing parameterized functions to define the channel cross-sections and iterative optimization, the system achieves improved cooling performance even in high-density, high-power electronic modules.
Claims Coverage
There are two main independent inventive features found in the claims of this patent.
Heat sink with cross-section defined by linear combination of sinusoidal spatial harmonics
A heat sink comprising: - A solid, thermally conductive material with a first surface to support components of the circuitry in selectively arranged positions and be thermally coupled with the circuitry, transferring heat through the first surface into the material, where the heat is distributed based on the component positions. - A second surface opposing the first, arranged to contact a cooling medium. - A cover that encapsulates the cooling medium between the cover and second surface, forming channels that cause the medium to flow in a defined direction. - The cross-section of the second surface orthogonal to the flow direction is shaped according to a predetermined linear combination of sinusoidal spatial harmonics (with 2≤N≠∞ terms), predetermined based on the distribution of heat transferred between the first and second surface.
Power module with integrated harmonically-shaped heat sink and circuitry
A power module comprising: - A substrate. - Circuitry disposed on the substrate. - The previously defined heat sink disposed on the substrate and thermally coupled with the circuitry. - Optional inclusion of a manifold fluidly connected to the heat sink channels and source of cooling fluid, supplying or returning the fluid at differing temperatures. - The module may be configured as a power-converter device with Si or SiC-based power-electronic switches.
The claims cover a heat sink for power electronics that has a geometry defined by a linear combination of sinusoidal spatial harmonics matched to the heat distribution from the circuitry, as well as the integration of this heat sink into a power module with specific arrangement for cooling and modularity.
Stated Advantages
Enables significant reduction in heat sink volume relative to conventional pin-fin constructions, improving power density in power modules.
Reduces pressure drop for the coolant, potentially minimizing additional power required for pumping while maintaining effective cooling performance.
Allows multi-objective optimization, balancing thermal performance, volume, and flow constraints for tailored applications.
Mitigates thermal imbalance across components by customizing the heat sink profile based on heat source distribution, improving device reliability and uniformity.
Supports efficient computational evaluation and optimization using reduced parameter sets (e.g., Fourier coefficients), leading to computationally practical design.
Documented Applications
Heat sinks for high power density power electronic modules in automotive and transportation applications.
Commercial power electronic modules and applications in the field of energy and utilities.
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