Methods and apparatuses for packaging an ultrasound-on-a-chip
Inventors
Fife, Keith G. • Liu, Jianwei • Betts, Andrew
Assignees
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Publication Number
US-12178648-B2
Publication Date
2024-12-31
Expiration Date
Abstract
Aspects of the disclosure described herein related to packaging an ultrasound-on-a-chip. In some embodiments, an apparatus includes an ultrasound-on-a-chip that has through-silicon vias (TSVs) and an interposer coupled to the ultrasound-on-a-chip and including vias, where the ultrasound-on-a-chip is coupled to the interposer such that the TSVs in the ultrasound-on-a-chip are electrically connected to the vias in the interposer. In some embodiments, an apparatus includes an ultrasound-on-a-chip having bond pads, an interposer that has bond pads and that is coupled to the ultrasound-on-a-chip, and wirebonds extending from the bond pads on the ultrasound-on-a-chip to the bond pads on the interposer.
Core Innovation
The invention relates to an ultrasound-on-a-chip package housed in a handheld ultrasound probe for portable ultrasound imaging. The ultrasound-on-a-chip package includes an ultrasound-on-a-chip and an interposer coupled to the ultrasound-on-a-chip, with electrically coupled vias for electrical connection and vias configured to conduct heat away from the ultrasound-on-a-chip.
In embodiments, the interposer is a hybrid structure that includes a ceramic heat-sink portion and an electrical connectivity portion. The ceramic heat-sink portion is formed of materials such as aluminum nitride, aluminum oxide, beryllium, or LTCC, and includes copper-pattern heat-transfer features, while the electrical connectivity portion is formed of organic, glass, or silicon.
The disclosed packaging further includes electrical connectivity between ultrasound-on-a-chip bond pads and interposer bond pads, including through-silicon vias (TSVs) and/or wirebond connections. Interfaces between the ultrasound-on-a-chip and the interposer can include underfill, adhesive, and/or empty space at the interface, and the interposer can be connected to a printed circuit board (PCB) via solder bumps.
Claims Coverage
The document provides coverage for at least two independent portable ultrasound imaging device claims, centered on an ultrasound-on-a-chip package housed in a hand-held ultrasound probe, with an interposer that provides electrical connection and, in some embodiments, heat removal via a different set of vias and/or wirebonds to bond pads. Across the independent claims, the inventive features focus on two inventive features.
Hand-held ultrasound probe with ultrasound-on-a-chip package and heat-conducting interposer vias
A portable ultrasound imaging device comprises a hand-held ultrasound probe and an ultrasound-on-a-chip package housed in the handheld ultrasound probe, where the ultrasound-on-a-chip package includes an ultrasound-on-a-chip and an interposer coupled to the ultrasound-on-a-chip, the interposer including a plurality of first vias electrically coupled to the ultrasound-on-a-chip and a plurality of second vias different than the plurality of first vias and configured to conduct heat away from the ultrasound-on-a-chip.
Wirebonds connecting ultrasound-on-a-chip bond pads to interposer bond pads
A portable ultrasound imaging device comprises a hand-held ultrasound probe and an ultrasound-on-a-chip package housed in the hand-held ultrasound probe, where the ultrasound-on-a-chip package includes an ultrasound-on-a-chip including first bond pads, an interposer comprising second bond pads and coupled to the ultrasound-on-a-chip, and wirebonds extending from the first bond pads on the ultrasound-on-a-chip to the second bond pads on the interposer.
Overall claim coverage focuses on a portable ultrasound imaging architecture with a handheld ultrasound probe containing an ultrasound-on-a-chip package, where an interposer provides electrically coupled vias and, in other implementations, wirebonds extend from ultrasound-on-a-chip bond pads to interposer bond pads.
Stated Advantages
Lower parasitic inductance/resistance for the packaging.
Enables surface-mount technology (SMT) high-throughput packaging.
Reduced risk of pressure damage to the sensor face.
Minimizing packaged footprint.
Documented Applications
Portable ultrasound imaging using a hand-held ultrasound probe that houses an ultrasound-on-a-chip package.
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