Methods for achieving an isolated electrical interface between an anterior surface of a microneedle structure and a posterior surface of a support structure
Inventors
Windmiller, Joshua • McCanna, James Patrick • Tangney, Jared Rylan
Assignees
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Publication Number
US-12109032-B1
Publication Date
2024-10-08
Expiration Date
Abstract
A method for circumscribing an insulating barrier region around a singular conductive microneedle structure or plurality of conductive microneedle structures adhered to a fixed substrate for the purpose of spatially defining a conduit for the routing of an electrical signal from the surface of said microneedle or microneedles to the posterior surface of the substrate is disclosed herein. A microneedle-based electrochemical biosensors structure comprises a substrate, a microneedle biosensor, a primary electrically conductive element, a secondary electrically conductive element and an electrically insulative annular barrier.
Core Innovation
The microneedle-based electrochemical biosensor structure comprises an electrically conductive microneedle and an electrically insulative annular barrier that electrically isolates the microneedle from an electrically conducting substrate. The microneedle includes a first portion within the substrate and a second portion extending from an anterior surface of the substrate, with a columnar body separating the penetrating end from the anterior surface by a length of the columnar body.
The microneedle carries a primary electrically conductive element located on the penetrating end, and a secondary electrically conductive element located on the posterior end of the microneedle and on a posterior surface of the substrate. The electrically insulative annular barrier surrounds the first portion of the microneedle and the length of the columnar body of the second portion, thereby isolating the microneedle from the substrate while maintaining electrical placement of the conductive elements on different sides of the substrate.
A printed circuit board comprising a pad, at least one via and a plurality of traces provides a conductive routing environment for interconnection to the posterior conductive element. Electrical interconnection is provided by a phase-change conductive interconnect positioned between the pad of the printed circuit board and the secondary electrically conductive element.
In embodiments with a plurality of microneedles, a corresponding plurality of primary electrically conductive elements and secondary electrically conductive elements are respectively located on microneedle penetrating ends and on posterior surfaces of the substrate, with respective electrically insulative annular barriers and respective phase-change conductive interconnects positioned between each pad and a corresponding secondary electrically conductive element.
Claims Coverage
The patent includes three independent claims that cover microneedle-based electrochemical biosensor structures with electrically isolating annular barriers, conductive primary and secondary elements on different microneedle ends/surfaces, and phase-change conductive interconnects to a printed circuit board, with variants for single versus plurality of microneedles and a simplified version without the printed circuit board and interconnects.
Electrically isolated conductive microneedle with annular barrier
An electrically conductive microneedle includes a first portion within an electrically conducting substrate and a second portion extending from an anterior surface of the substrate, and an electrically insulative annular barrier surrounding the first portion of the microneedle and the length of the columnar body of the second portion electrically isolates the microneedle from the substrate.
Primary and secondary conductive elements on microneedle ends and substrate posterior surface
A primary electrically conductive element located on the penetrating end of the microneedle and a secondary electrically conductive element located on the posterior end of the microneedle and on a posterior surface of the substrate, where the electrically insulative annular barrier electrically isolates the microneedle from the substrate.
PCB pad interconnection via phase-change conductive interconnect to secondary element
A printed circuit board comprising a pad, at least one via and a plurality of traces, together with a phase-change conductive interconnect positioned between the pad of the printed circuit board and the secondary electrically conductive element.
Plurality of microneedles with respective conductive elements, annular barriers, and interconnects
A plurality of electrically conductive microneedles each with a penetrating end having a primary electrically conductive element, secondary electrically conductive elements located on posterior surfaces, a plurality of electrically insulative annular barriers each surrounding the first portion and the length of the columnar body of a respective microneedle, and a plurality of phase-change conductive interconnects each positioned between the pad of the printed circuit board and a respective secondary electrically conductive element.
Secondary conductive element encapsulated by annular barrier
The secondary electrically conductive element is located on the posterior end of the microneedle and on a posterior surface of the substrate, and the electrically insulative annular barrier surrounds the first portion of the microneedle and the length of the columnar body of the second portion, electrically isolating the microneedle from the substrate, including that the secondary electrically conductive element is surrounded by the electrically insulative annular barrier.
Across the independent claims, the inventive coverage centers on an electrically conductive microneedle electrically isolated from a conducting substrate by an electrically insulative annular barrier, with conductive primary and secondary elements placed on the microneedle penetrating end and posterior end/posterior surface, and where applicable, electrical interconnection to a printed circuit board using phase-change conductive interconnects.
Stated Advantages
Electrically isolates the microneedle from the substrate.
Documented Applications
Not explicitly described in patent.
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