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Publication Number
US-12048930-B2
Publication Date
2024-07-30
Expiration Date
Abstract
A heater (22) for heating a substantially transparent or translucent cover of a reaction vessel. The heater has a board (80) having a front face, an opposing back face, and an aperture (1062) through which an excitation beam can pass into a reaction vessel via a cover of the reaction vessel, and/or through which reaction light can pass from the reaction vessel via the cover. A thermally conductive, heat-spreading layer (86) radiates heat towards the cover, the heat-spreading layer being arranged on the front face of the board that is arranged to face the cover. At least one heating element outputs heat to the heat-spreading layer (86), the heating element being arranged on the back face of the board that is arranged to face away from the cover. The heat-spreading layer (86) is in thermal communication with the heating element by at least one heating via 82 through the board.
Core Innovation
The invention provides a heater for heating a substantially transparent or translucent cover of a reaction vessel. The heater includes a board having a front face and an opposing back face, and an aperture through which an excitation beam can pass into a reaction vessel via the cover and/or through which reaction light can pass from the reaction vessel via the cover. A thermally conductive, heat-spreading layer is arranged on the front face of the board that faces the cover, and the heat-spreading layer is configured to radiate heat towards the cover.
Heat is output to the heat-spreading layer by at least one heating element arranged on the back face of the board that faces away from the cover of the reaction vessel. The heat-spreading layer is placed in thermal communication with the heating element by at least one heating via through the board. This arrangement establishes a heat-spreading radiator on the cover-facing side while heating is delivered from the opposite side through thermal communication vias.
The described implementations include temperature sensing with temperature-sensing elements arranged on the back face of the board, configured to sense temperature at or near locations on the front face through sensing vias through the board. The heat-spreading layer can be configured with heat-spreading sections that are substantially thermally insulated from other sections, with independently controllable heating elements for respective sections. The document further describes printed circuit board structures, including glass-transition temperature (Tg) constraints and board thickness constraints, and supports optical integration through the board aperture(s).
Claims Coverage
The independent claim family is directed to a heater for heating a substantially transparent or translucent reaction-vessel cover. The inventive features include an aperture for an excitation beam and/or reaction light, a radiative heat-spreading layer on the cover-facing front face, heating elements on the opposite back face, and thermal communication through heating vias through the board. Dependent claims further add temperature sensing via sensing vias and refine structural and geometric constraints, including multi-section heat-spreading and optional independent control and insulation between sections.
Board with aperture for excitation beam and/or reaction light
A board having a front face and an opposing back face, and having an aperture through which an excitation beam can pass into a reaction vessel via a cover of the reaction vessel, and/or through which reaction light can pass from the reaction vessel via the cover.
Radiative heat-spreading layer arranged on the front face
A thermally conductive, heat-spreading layer configured to radiate heat towards a cover of a reaction vessel, the heat-spreading layer being arranged on the front face of the board that is arranged to face the cover.
Heating element arranged on the back face
At least one heating element configured to output heat to the heat-spreading layer, the heating element being arranged on the back face of the board that is arranged to face away from the cover of a reaction vessel.
Thermal communication via heating via through the board
The heat-spreading layer being in thermal communication with the heating element by at least one heating via through the board.
Temperature sensing through sensing via through the board
At least one temperature-sensing element arranged on the back face of the board, configured to sense temperature at or near locations on the front face via at least one sensing via through the board.
Multiple heat-spreading sections with substantially thermally insulated sections and independent control
A plurality of heat-spreading sections, wherein each heat-spreading section is substantially thermally insulated from one or more other heat-spreading sections, the heating element(s) of at least one section being configured to independently control the temperature of the at least one heat-spreading section.
Printed circuit board Tg constraint
A board with a glass-transition temperature (Tg) greater than or equal to about 120°C and/or about 130°C and/or about 140°C and/or about 150°C.
Board thickness constraint
The board having a thickness that is one of about 0.2 mm to about 2.3 mm, about 0.4 mm to about 2.0 mm, about 0.5 mm to about 1.6 mm, about 0.6 mm to about 1.6 mm, about 0.8 mm to about 1.5 mm, about 1.0 mm to about 1.5 mm, or about 1.2 mm.
Cover spacing between board front face and cover
A cover of a reaction vessel wherein the front face of the board is at a distance of about 0 mm to about 1 mm from the cover, or about 1 mm to about 3 mm, or about 1.5 mm to about 2.5 mm, or about 2 mm.
Overall, the claim coverage centers on a heater architecture that couples heating elements located on the back face to a radiative heat-spreading layer on the front face through heating vias through the board, while also providing an aperture for excitation beam and/or reaction light. Additional dependent features include temperature sensing via sensing vias, multi-section heat-spreading with substantially thermally insulated sections and independently controllable heating, and further constraints on board material Tg, board thickness, and spacing between the board front face and the cover.
Stated Advantages
Mitigate condensation on a substantially transparent or translucent reaction-vessel cover by radiative heating.
Reduce edge effects by using independently controlled, thermally insulated heat-spreading sections.
Reduce power for a battery handheld implementation.
Documented Applications
A molecule-detection device employing a reaction-vessel holder and an apparatus/controller that detects molecule(s) using excitation and detection through the cover heater aperture(s).
A portable handheld device implementation, including a battery-powered arrangement with thermal management and controller/heater control.
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