Thin film support structures
Inventors
Toth, Landy • Schwartz, Robert S.
Assignees
Publication Number
US-11872043-B2
Publication Date
2024-01-16
Expiration Date
2037-07-10
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Abstract
A method includes forming a film, forming a first pattern of two or more vias at least partially through the film, attaching the film to a first support structure, the first support structure comprising an adhesive layer formed over a first carrier, wherein attaching the film to the first support structure comprises bonding a first surface of the film to the adhesive layer of the first support structure, wherein the film is stretchable in at least a first direction along the first surface, and wherein the first carrier maintains the first pattern of vias within a given threshold distortion following a given process conducted after attaching the film to the first support structure.
Core Innovation
The invention relates to thin film support structures and manufacturing methods that facilitate the use of thin films for stretchable, flexible, and breathable devices across various applications. The disclosed method involves forming a film, creating a pattern of two or more vias at least partially through the film, and then attaching the film to a first support structure consisting of an adhesive layer on a first carrier. This process requires bonding one surface of the film to the adhesive layer such that the film remains stretchable in at least one direction, and the carrier provides sufficient rigidity to maintain the precise arrangement of vias within a given threshold distortion even after further processing, such as heating or roll-to-roll handling.
The problem addressed by the invention is rooted in the challenges of miniaturizing devices for fields like physiological monitoring and microelectronics. As devices shrink, fabricating and handling thin films becomes difficult because these films lack structural stability. Thin films are prone to distortion, stretching, or damage during processing steps such as exposure to heat, solvents, or mechanical web tension, which can compromise the precision alignment required for high-yield, reliable integration of microelectronic structures and functional features. These issues are especially relevant for applications requiring comfort, flexibility, and unobtrusiveness, such as wearable medical devices.
The disclosed thin film support structures overcome these challenges by providing a mechanically strong and often thermally stable carrier or liner that constrains the thin film during fabrication, feature formation, and device handling. This arrangement maintains the critical pattern integrity of structures like vias or through-holes that serve as interconnects or feature sites. In operation, this solution enables the manufacture and integration of precision-patterned microelectronic structures on or through extremely thin, stretchable, or breathable films using scalable processes while minimizing distortion, feature misalignment, and structural damage, and facilitating easy removal of carriers after processing without affecting the functional utility of the final product.
Claims Coverage
The patent contains multiple independent claims, focusing on the structure, fabrication, and features of thin film support structures and their application as stretchable, wrinkle-enabled electronic patches. The following are the main inventive features derived from the independent claims.
Wrinkle-enabled stretchable functional layer on thin film supported by rigid carrier
An apparatus includes: - A first support structure comprising an adhesive layer on a first carrier. - A film attached to the support structure, with a pattern of two or more vias at least partially through it; the first surface of the film is bonded to the adhesive layer. - The film is stretchable in at least a first direction along the first surface. - At least one functional layer is formed over a second surface of the film, opposite the first, where the layer comprises one or more wrinkles. These wrinkles have an amplitude oriented perpendicular to the film and a wavelength along the stretchable direction, enabling stretching of the functional layer in the first direction. - The carrier material has a rigidity greater than that of the film and maintains the pattern of vias within a threshold distortion after processing, such as distortion less than 1%, less than 10 μm, or in distance between via centers less than 10 μm.
Patch structure with microelectronic features, liner, and wrinkle-enabled functional layers
A patch comprises: - A first support structure with an adhesive layer formed over a first carrier. - A film, stretchable in at least one direction, attached to the support structure and comprising a pattern of two or more vias. - One or more microelectronic structures, either formed in at least one via or patterned on the second surface of the film. - A surface adhesive over at least part of the second surface and a liner attached to this adhesive. - At least one functional layer on the second surface comprises wrinkles (with amplitude perpendicular to the second surface and wavelength along the stretch direction), enabling stretching. - The first carrier has rigidity greater than the film, maintaining via pattern integrity within a threshold distortion after processing.
The claims cover thin film support structures and patches that integrate stretchable, wrinkle-enabled functional layers with exact via patterning, maintained by a more rigid carrier to preserve pattern integrity through manufacturing processes. These structures incorporate precise alignment capabilities, compatibility with microelectronic features, and facilitate ease of manufacturing and application.
Stated Advantages
The invention permits precise formation and maintenance of via patterns and microelectronic structures in thin, stretchable films during manufacturing and handling, minimizing distortion and misalignment even during thermal or mechanical processing.
Thin film support structures enable efficient roll-to-roll fabrication and scalable, high-yield production of flexible, breathable, and stretchable electronic devices, including wearable patches and microelectronic devices.
The support structures facilitate easy removal of the carrier after processing, reducing distortion, damage, and functional loss to thin films and integrated features, and improve product yield and reliability.
They allow the use of extremely thin, soft, and breathable films in applications requiring comfort, flexibility, and unobtrusiveness—such as long-term wearable medical patches or devices.
The approach improves the stability and handle-ability of delicate films, protects against sagging or damage, and supports precise alignment essential for integrating multi-layered circuits and features.
Documented Applications
Devices and patches for physiological monitoring, enabling comfortable, stretchable, and breathable long-term wearable sensors.
Microelectronic devices such as RFID tags, near field communication (NFC) tags, and sensors for tracking goods in supply chains.
Foldable antennas and wearable art structures, including light emitting temporary tattoos and flexible displays.
Thermal therapeutic devices including flexible and breathable heating or cooling elements incorporating microelectronics.
Devices for drug delivery or fluid sensing with integrated microchannels and microelectronics.
Temporary displays for readouts, touch sensitive panels, interfacial pressure sensing structures, and other medical monitoring devices.
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