Implantable optical sensor with hermetically sealed cover cap
Inventors
Van Schuylenbergh, Koenraad • Delbeke, Danaë • CARDILE, Paolo
Assignees
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Publication Number
US-11372176-B2
Publication Date
2022-06-28
Expiration Date
Abstract
An implantable optical sensor comprises a photonic integrated circuit comprising a substrate 2 and an optical microstructure 3 integrated with the substrate 2. The optical microstructure is positioned to form an exposed optical interaction area 4 on a part of a surface 5 of the substrate 2. A cover cap 6 is sealed onto a part of the substrate 2 adjacent to the optical interaction area 4 and by wafer-to-wafer bonding technology or another wafer-level hermetic packaging technique. At least one active component 8 is positioned in a sealed cavity 9 which is formed between the surface 5 and the cover cap 6. The substrate 2 comprises at least one optical feedthrough 10, which is an embedded waveguide extending from the sealed cavity 9 to the optical interaction area 4.
Core Innovation
The invention relates to an implantable optical sensor that uses a photonic integrated circuit including a substrate, an optical microstructure integrated with the substrate, and at least one active component that comprises a light source. The optical microstructure is locally etched open to form an optical interaction area on a part of a surface of the substrate, so that light is exposed from the light source at the optical interaction area. The optical microstructure is an integrated waveguide configured to confine light from the light source within a sealed cavity and expose the light at the optical interaction area.
A cover cap is provided on a part of the substrate adjacent to the optical interaction area, where the cover cap is hermetically sealed to the substrate at a wafer level or at a die level. The light source is positioned in a sealed cavity formed between the surface of the substrate and the cover cap. The photonic integrated circuit further comprises at least one optical feedthrough extending from the sealed cavity to the optical interaction area, and the optical feedthrough is an embedded waveguide in the substrate.
The embedded-waveguide optical feedthrough optically couples the sealed cavity to the exposed optical interaction area without protruding the cover cap. Further embodiments include additional sealed cavity routing such as electrical feedthroughs and optional electromagnetic shielding. A protective layer may be provided with an aperture aligned to the optical interaction area, and the system may include an antenna for power/data exchange and energy supply or harvesting options, enabling use in harsh or fluid environments and in an active implantable medical device for sensing biomolecules.
Claims Coverage
The independent claims cover an implantable optical sensor architecture and manufacturing of the same. Across these independent claims, the inventive features are organized around locally forming an optical interaction area, placing a light source in a hermetically sealed cavity under a cover cap, and optically coupling that cavity to the interaction area via an embedded waveguide feedthrough connected to an integrated waveguide.
Locally etched optical interaction area with light exposure
The optical microstructure is locally etched open to form an optical interaction area on a part of a surface of the substrate to expose light from the light source.
Hermetically sealed cavity under a cover cap
A cover cap on a part of the substrate adjacent to the optical interaction area is hermetically sealed to the substrate at a wafer level or at a die level, and the light source is positioned in a sealed cavity formed between the surface of the substrate and the cover cap.
Embedded-waveguide optical feedthrough from sealed cavity
At least one optical feedthrough extending from the sealed cavity to the optical interaction area is an embedded waveguide in the substrate.
Integrated waveguide confining light and exposing at interaction area
The optical microstructure is an integrated waveguide connected to the optical feedthrough and configured to confine the light from the light source within the sealed cavity and expose the light at the optical interaction area.
Manufacturing by locally etching optical microstructure and wafer-level or die-level sealing
Providing a photonic integrated circuit with an integrated optical microstructure and an embedded waveguide optical feedthrough, locally etching the optical microstructure open to form the optical interaction area, providing the light source on the surface of the substrate adjacent to the optical interaction area, providing a cover cap to form a sealed cavity, and sealing the cover cap to the substrate using wafer-level or die-level hermetic packaging technique.
Overall, the independent claims require an implantable photonic integrated circuit with a locally opened optical interaction area, a light source housed in a hermetically sealed cavity under a cover cap, and optical coupling from the sealed cavity to the interaction area through an embedded waveguide optical feedthrough connected to an integrated waveguide that confines and exposes light.
Stated Advantages
Provides advantages for harsh/fluid environments.
Supports use in an active implantable medical device for sensing biomolecules, including glucose and other analytes.
Enables optical coupling to the optical interaction area without protruding the cap.
Documented Applications
An active implantable medical device for sensing biomolecules, including glucose and other analytes.
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