Thermocycling system, composition, and microfabrication method
Inventors
Brahmasandra, Sundaresh • Haddock, Thomas • Duffy, Patrick • Williams, Jeffrey
Assignees
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Publication Number
US-11273448-B2
Publication Date
2022-03-15
Expiration Date
Abstract
A system and method of manufacture for the system, comprising a set of heater-sensor dies, each heater-sensor die comprising an assembly including a first insulating layer, a heating region comprising an adhesion material layer coupled to the first insulating layer and a noble material layer, and a second insulating layer coupled to the heating region and to the first insulating layer through a pattern of voids in the heating region, wherein the pattern of voids in heating region defines a coarse pattern associated with a heating element of the heating region and a fine pattern, integrated into the coarse pattern and associated with a sensing element of the heating region; an electronics substrate configured to couple heating elements and sensing elements of the set of heater-sensor dies to a controller; and a set of elastic elements configured to bias each of the set of heater-sensor dies against a detection chamber.
Core Innovation
The invention describes a thermocycling system for thermocycling biological samples within detection chambers, using a set of integrated heater-sensor thin-film dies biased against the detection chambers. The dies include first and second insulating layers and a heating region with a heating element and an integrated sensing element, where the heating element and sensing element are formed within a patterned layer stack.
Within the heating region, a pattern of voids defines a coarse pattern associated with the heating element and a fine pattern integrated into the coarse pattern and associated with the sensing element. The void pattern is formed by removing material of the heating region entirely to the first insulating layer, including lithographically etching boustrophedonic segments across the adhesion material layer and the noble material layer to create wide segments for the heating element and narrower segments for the sensing element.
The invention further provides annealing of the first insulating layer, the heating region, and the second insulating layer to stabilize thin-film electrical resistance and prevent signal drift over long use. Annealing is described as occurring in an inert atmosphere, and the layer stack includes an adhesion material layer on the first insulating layer and a noble metal layer on the adhesion material layer.
Claims Coverage
The partial content includes two independent claims. Across these claims, the inventive coverage centers on a void-defined heating region with integrated heating and sensing morphologies, and on annealing the resulting thin-film stack; one independent claim also adds an intermediate buffer layer as a diffusion barrier.
Void-defined coarse and fine heating/sensing morphology integration
Forming a pattern of voids that defines a coarse pattern associated with a heating element and a fine pattern, integrated into the coarse pattern and associated with a sensing element, including lithographically etching boustrophedonic segments across the adhesion material layer and the noble material layer with wide segments of the coarse pattern and narrower segments of the fine pattern.
Layer stack insulating layers coupled through the void pattern
Forming a first insulating layer on a substrate and forming a second insulating layer coupled to the heating region and to the first insulating layer by way of the pattern of voids, where the void pattern couples the insulating layers and defines the heating element and sensing element morphologies.
Annealing of insulating and heating-region layers in inert atmosphere
Annealing the first insulating layer, the heating region, and the second insulating layer.
Global and local void-pattern morphologies for heating element and sensing element
Coupling a second insulating layer to a first insulating layer through a pattern of voids, where the pattern of voids defines a first pattern comprising a global morphology at a first size scale associated with the heating element and a second pattern comprising a local morphology at a second size scale smaller than the first size scale integrated into the first pattern and associated with the sensing element.
Intermediate buffer layer diffusion barrier between adhesion and noble metal
Forming an intermediate buffer layer comprising at least one of platinum and titanium disposed between the adhesion material layer and the noble metal layer to provide a diffusion barrier between the adhesion material layer and the noble metal layer.
Together, the independent claims cover manufacturing approaches that create a void-defined heating region with integrated heating and sensing morphologies, coupled insulating layers through the void pattern, and annealing of the insulating and heating-region stack; one independent claim also includes an intermediate platinum/titanium buffer layer as a diffusion barrier.
Stated Advantages
Prevents signal drift over long use by stabilizing thin-film electrical resistance.
Documented Applications
Thermocycling biological samples within detection chambers using the described thermocycling system and integrated heater-sensor thin-film dies.
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