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Publication Number
US-11198011-B2
Publication Date
2021-12-14
Expiration Date
Abstract
Generally discussed herein are systems, devices, and methods for providing a therapy (e.g., stimulation) and/or data signal using an implantable device. Systems, devices and methods for interacting with (e.g., communicating with, receiving power from) an external device are also provided.
Core Innovation
The invention relates to an implantable device that includes a feedthrough assembly configured to hermetically seal a portion of a device housing. The feedthrough assembly includes an inner region with one or more electrical conductors extending from an outer-facing first surface to respective solder bumps on an opposite second surface, and an outer flange surrounding the inner region.
When the feedthrough assembly seals the housing portion, the second surface faces an inside of the device housing and the solder bumps are disposed inside the device housing. The electrical conductors from the inner region are respectively coupled with conductive pads of a circuit assembly using the solder bumps, establishing electrical coupling while maintaining the hermetic seal.
The disclosed implantable system includes an elongate structure configured for implantation and a circuit assembly with proximal and distal portions coupled by at least one flexible circuit portion. A hermetic enclosure encloses the circuit assembly and includes first and second feedthrough assemblies, with the first feedthrough assembly coupling first electrical conductors to respective second conductors on the proximal portion and the second feedthrough assembly coupling third electrical conductors to respective fourth conductors on the distal portion.
Claims Coverage
The claim coverage includes two independent claims and centers on hermetic feedthrough assemblies with an inner region of electrical conductors and an outer flange, where conductors are electrically coupled using solder bumps. One claim is directed to an implantable device, and the other is directed to an implantable system with proximal and distal circuit portions coupled by at least one flexible circuit portion.
Hermetic feedthrough with solder-bump coupling to circuit pads
An implantable device comprising a feedthrough assembly configured to hermetically seal a portion of a device housing, wherein the feedthrough assembly includes an inner region with one or more electrical conductors extending from an outer-facing first surface to respective solder bumps on an opposite second surface, with the second surface facing an inside of the device housing and the solder bumps disposed inside the device housing, and an outer flange surrounding the inner region; and a circuit assembly including one or more conductive pads on a surface, wherein the electrical conductors from the inner region are respectively coupled with the one or more conductive pads using the solder bumps.
Hermetic enclosure with proximal and distal feedthrough assemblies
An implantable system comprising an elongate structure for implantation, a circuit assembly with proximal and distal portions coupled by at least one flexible circuit portion, and a hermetic enclosure enclosing the circuit assembly, where the hermetic enclosure includes a first feedthrough assembly with first electrical conductors coupled to respective second conductors on the proximal portion and a second feedthrough assembly with third electrical conductors coupled to respective fourth conductors on the distal portion, and the first feedthrough assembly includes an inner region with the first electrical conductors extending from solder bumps at one surface to an opposite surface, with an outer flange surrounding the inner region.
The claims focus on hermetic feedthrough assemblies that include an inner region of electrical conductors terminating at solder bumps inside the hermetic enclosure and electrically coupling to conductors or pads of a circuit assembly. The system claim further pairs this feedthrough arrangement with proximal and distal circuit portions connected by at least one flexible circuit portion and enclosed within a hermetic enclosure that includes both first and second feedthrough assemblies.
Stated Advantages
Not explicitly described in patent.
Documented Applications
Not explicitly described in patent.
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