Multi-card subsystem for embedded computing systems
Inventors
Holahan, Michael M. • Bober, Nick R.
Assignees
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Publication Number
US-11071221-B2
Publication Date
2021-07-20
Expiration Date
Abstract
A mounting frame apparatus is provided for embedding cards within an electronics system and includes a multi-card swappable subsystem. The apparatus further includes a chassis for containing the multi-card swappable subsystem. One or more heatsinks are used for cooling cards disposed in the four-card swappable subsystem.
Core Innovation
The invention provides a mounting frame apparatus for embedding cards within an electronics system. It includes a four-card swappable subsystem contained in a chassis, where the chassis includes slots for swapping cards in and out for plug and play, and the slots have pairs of grooves in a spaced facing relationship, with the grooves U-shaped formed in the outside walls of the chassis for each of the four swappable individual cards.
A cooling structure supplies cooling air to the four-card swappable subsystem. The four-card swappable subsystem includes a single heatsink for cooling multiple cards, wherein the single heatsink is integrally formed in the four-card swappable subsystem, attached to the multiple cards, and serves as a common heatsink for the multiple cards.
In an additional embodiment, the cooling structure supplies cooling fluid to the four-card swappable subsystem, including a condenser channel and an evaporator channel. Heat generated during operation of the embedded cards is exhausted into an ambient environment, while the common heatsink remains integrally formed in the four-card swappable subsystem and attached to the multiple cards.
The architecture is described as scalable beyond four cards, including configurations such as a 12-card chassis and stackable configurations. The centralized common heatsink concept is used to support application-specific plug-and-play suites, including video processing, trusted communications, trusted storage, and imaging, with the shared heatsink cooling multiple cards.
Claims Coverage
The document contains two independent claims, each covering a four-card swappable mounting frame with plug-and-play card exchange using chassis slots with U-shaped grooves and a single common heatsink within the four-card swappable subsystem. The first independent claim focuses on cooling via cooling air, while the second independent claim focuses on cooling fluid with condenser and evaporator channels exhausting heat to ambient.
Four-card swappable subsystem in a chassis with U-shaped grooves for plug and play
The chassis contains the four-card swappable subsystem, with slots including pairs of grooves in a spaced facing relationship for swapping cards in and out of the chassis for plug and play, where the grooves are U-shaped formed in the outside walls of the chassis for each of the four swappable individual cards.
Single common heatsink integrally formed in the four-card swappable subsystem
A single heatsink for cooling multiple cards is integrally formed in the four-card swappable subsystem, attached to the multiple cards and configured as a common heatsink for the multiple cards.
Cooling structure supplying cooling air to the four-card swappable subsystem
A cooling structure supplies cooling air to the four-card swappable subsystem.
Cooling fluid structure with condenser channel and evaporator channel exhausting heat to ambient
The cooling structure supplies a cooling fluid to the four-card swappable subsystem and includes a condenser channel and an evaporator channel so that heat generated during operation of the embedded cards is exhausted into an ambient environment.
Across the independent claims, the main inventive features are the plug-and-play four-card chassis with U-shaped grooves, a single integrally formed common heatsink attached to multiple cards, and a cooling structure that either supplies cooling air or supplies cooling fluid with condenser and evaporator channels exhausting heat to ambient.
Stated Advantages
Improved thermal transfer via module frame-to-heatsink contact.
Potential reduction in fan power and chassis size.
Rapid reconfiguration and field serviceability enabled by plug-and-play card swapping.
Documented Applications
Application-specific plug-and-play suites for video processing.
Application-specific plug-and-play suites for trusted communications.
Application-specific plug-and-play suites for trusted storage.
Application-specific plug-and-play suites for imaging.
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