Laser induced ballistic particle implantation technique
Inventors
Ringeisen, Bradley R. • Wu, Peter K.
Assignees
Publication Number
US-11027145-B2
Publication Date
2021-06-08
Expiration Date
2038-12-14
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Abstract
A method using a receiving substrate and a target substrate having a photon-transparent support, a photon absorbent interlayer coated on the support, and a tissue-implantable particle on top of the interlayer opposite to the support. A source of photon energy is directed through the transparent support so that the photon energy strikes the interlayer. A portion of the interlayer is energized by absorption of the photon energy. The energized interlayer causes a transfer of the particle across a gap between the target substrate and the receiving substrate and embedding of the particle into the receiving substrate.
Core Innovation
The invention discloses a method for implanting tissue-implantable particles using a target substrate comprising a photon-transparent support, a photon absorbent interlayer on the support, and the particle on top of the interlayer. Photon energy is directed through the transparent support so that it strikes and energizes the interlayer, causing a transfer of the particle across a gap to a receiving substrate, where the particle becomes embedded.
The method addresses the problem of implanting micro/nano scale devices or particles into tissue or soft substrates with high precision and minimal damage. Traditional ballistic implantation methods cause large scale tissue damage and are not precise, while ion implantation is unsuitable for biological applications. The described technique enables implantation without the need for carrier particles that cause unnecessary tissue damage, avoids large shock waves from gas pulses, and allows precise control of implantation depth and positioning.
Claims Coverage
The patent includes one independent claim that covers a method for ballistic implantation using a photon-transparent substrate and a photon absorbent interlayer to transfer particles such as integrated circuits into living tissue.
Method of laser-induced ballistic implantation into living tissue
A method comprising: providing a receiving substrate that includes living tissue, a living organism, or a human; providing a target substrate with a photon-transparent support coated with a photon absorbent interlayer and a tissue-implantable particle (specifically an integrated circuit) on top; providing a source of photon energy; and directing the photon energy through the transparent support to energize the interlayer, thereby causing transfer and embedding of the particle into the receiving substrate across a gap.
The inventive features center on using laser-induced forward transfer through a photon-transparent support and absorbent interlayer to precisely implant integrated circuit particles into living substrates by transferring and embedding them without carrier particles.
Stated Advantages
Implantation can be visually observed in real-time by the operator.
Implantation depth can be controlled up to hundreds of microns by adjusting laser energy.
The non-contact mechanism eliminates contamination risks.
Single device or particle implantation with micrometer resolution is achievable anywhere on a substrate.
Multiple types of devices or particles can be implanted simultaneously in a controlled pattern with micrometer resolution.
Minimal damage occurs to the substrate or tissue during implantation.
Documented Applications
Implantation of microelectronics devices, including integrated circuits, into living tissue, engineered tissue, or hydrogels.
Implantation of drug delivery devices into tissue.
Use in treatment of wounds or tumors by implanting particles or devices.
Deposition of artificial sensors to replace damaged or missing natural ones, such as in the retina.
Monitoring cell growth and healing processes, administering programmed medication, stimulating or monitoring nerve and growth mechanisms, and identifying or eliminating malignant microbes in biological tissue.
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