Single package optically-activated gas sensors
Inventors
Motayed, Abhishek • Debnath, Ratan • Thomson, Brian
Assignees
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Publication Number
US-10983102-B2
Publication Date
2021-04-20
Expiration Date
Abstract
Systems and methods provide for manufacturing and assembling a single package gas sensor. The method includes: disposing a substrate in a housing; disposing at least one gas sensor die on the substrate; disposing at least one ultraviolet (UV) light emitting diode (LED) on the substrate; and attaching a lid to the housing, wherein the lid includes at least one gas ingress point.
Core Innovation
The invention relates to an optically activated single package gas sensor architecture that integrates a substrate carrying at least one gas sensor die and at least one ultraviolet (UV) light emitting diode (LED) in a housing. A lid is attached to the housing and includes at least one gas ingress point, while the interior surface of the lid is a sole reflective surface. Light emitted from the UV LED is reflected off the interior surface of the lid so the reflected light is received by the gas sensor die to electrically activate the gas sensor die.
Within the package, the gas sensor die includes one or more particle gas sensors on a chip configured to detect at least one type of gas. The chip includes a first semiconductor layer on top of a substrate layer, semiconductor electrodes etched from the first semiconductor layer, and an adsorption layer for at least some of the one or more particle gas sensors. The adsorption layer adsorbs a first type of gas and a first interfering compound using deposits located on a first subset of the semiconductor electrodes, including either first metal oxide particles with second metal oxide particles or third metal oxide particles with first metal particles.
The document further describes packaging-specific aspects that distinguish the single-package integration from arrangements that keep the UV LED and sensing function in separately enclosed compartments. It emphasizes that the lid interior reflective surface directs reflected UV light to electrically activate the gas sensor die, and that configurable lid and UV LED features can be used to adjust operation and performance.
Claims Coverage
The patent contains two independent claims. Across these claims, the coverage centers on a single package gas sensor with UV LED optical activation via a lid reflective surface and, within the gas sensor die, on-chip particle gas sensors that include a semiconductor electrode structure and an adsorption layer configured to adsorb a gas and an interfering compound using specified metal/metal-oxide deposit combinations.
Optically activated single package gas sensor with sole reflective lid
A single package gas sensor comprising a substrate; at least one gas sensor die disposed on the substrate; at least one ultraviolet (UV) LED disposed on the substrate; a housing for containing the substrate, the gas sensor die and the UV LED; and a lid attached to the housing including at least one gas ingress point. Light emitted from the UV LED is reflected off an interior surface of the lid such that the reflected light is received by the gas sensor die to electrically activate the gas sensor die, wherein the interior surface of the lid is a sole reflective surface.
On-chip particle gas sensors with adsorption layer for gas and interfering compound
The at least one gas sensor die further comprises one or more particle gas sensors on a chip configured to detect at least one type of gas, the chip having a first semiconductor layer on top of a substrate layer; a plurality of semiconductor electrodes etched from the first semiconductor layer; and an adsorption layer for at least some of the one or more particle gas sensors. The adsorption layer adsorbs a first type of gas and a first interfering compound, wherein the adsorption layer includes deposits of either first metal oxide particles and second metal oxide particles on a first subset of the plurality of semiconductor electrodes or third metal oxide particles and first metal particles on the first subset of the semiconductor electrodes.
Assembling the single package gas sensor with UV reflection from sole reflective lid
A method for assembling a single package gas sensor including disposing a substrate in a housing; disposing at least one gas sensor die on the substrate; disposing at least one UV LED on the substrate; and attaching a lid to the housing including at least one gas ingress point. Light emitted from the UV LED is reflected off an interior surface the lid such that the reflected light is received by the gas sensor die to electrically activate the gas sensor die, wherein the interior surface of the lid is a sole reflective surface.
Method-determined on-chip particle gas sensors with specified adsorption deposits
The at least one gas sensor die used in the method includes one or more particle gas sensors on a chip configured to detect at least one type of gas, with a first semiconductor layer on top of a substrate layer; semiconductor electrodes etched from the first semiconductor layer; and an adsorption layer that adsorbs a first type of gas and a first interfering compound. The adsorption layer includes deposits of either first metal oxide particles and second metal oxide particles on a first subset of the plurality of semiconductor electrodes or third metal oxide particles and first metal particles on the first subset of the semiconductor electrodes.
Overall, the claim coverage ties together a single package arrangement where UV LED light is reflected from a lid sole reflective surface to electrically activate the gas sensor die, and a gas sensor die implementation using on-chip particle gas sensors with a semiconductor electrode structure and an adsorption layer configured to adsorb a target gas and an interfering compound via specific metal/metal-oxide deposit combinations.
Stated Advantages
Electrically activates the gas sensor die using reflected UV light from a lid interior sole reflective surface.
Enables a single package gas sensor architecture integrating the UV LED and gas sensor die within a housing.
Supports selective gas sensing for gases and interfering compounds via an adsorption layer configured to adsorb a first type of gas and a first interfering compound.
Documented Applications
UV-assisted gas detection with examples of gas sensing performance including selectivity for aromatics, nitroaromatics/explosives, NO2, alcohols/hydrogen.
Detection examples referenced for explosives including TNT and DNT.
Multi-gas detection using multiple sensor-element die concepts within the package for detecting multiple gas types.
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