Thermoelectric heating/cooling devices including resistive heaters
Inventors
Crocco, Paul • Mahadevan, Ramaswamy • Deane, Philip A.
Assignees
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Publication Number
US-10634396-B2
Publication Date
2020-04-28
Expiration Date
Abstract
A thermoelectric heating/cooling device may include first and second thermally conductive headers. A plurality of thermoelectric elements thermally may be coupled in parallel between the first and second thermally conductive headers. In addition, a resistive heating element may be provided on the second header, and the second header may be between the resistive heating element and the plurality of thermoelectric elements.
Core Innovation
The invention provides a thermoelectric heating/cooling device that includes first and second thermally conductive headers and a plurality of thermoelectric elements electrically coupled by conductive traces on the headers and thermally coupled in parallel between the first and second thermally conductive headers. A resistive heating element is integrated in a surface of the second thermally conductive header and configured to generate resistive heat in response to a resistive heater control signal. The second thermally conductive header is positioned between the resistive heating element and the plurality of thermoelectric elements.
A controller is coupled to at least one of the conductive traces and to the resistive heating element. The controller applies a thermoelectric control signal to the plurality of thermoelectric elements to pump heat from the first thermally conductive header to the second thermally conductive header while simultaneously applying the resistive heater control signal to the resistive heating element on the second thermally conductive header. In described embodiments, additional control behavior includes blocking electrical current to the resistive heating element while applying a second thermoelectric control signal to pump heat.
The invention also includes structural integration features for the resistive heating element on the second thermally conductive header. The second thermally conductive header defines a trench in a surface thereof opposite the plurality of thermoelectric elements, with portions of the resistive heating element recessed in the trench and an electrically insulating capping layer positioned in the trench on the resistive heating element. The documented structural context further includes a load thermally decoupling the thermoelectric elements from the resistive heater so that the thermal path reduces thermoelectric temperature, supporting reduced maximum/average temperatures and claimed life increase of the thermoelectric elements.
Claims Coverage
This patent document includes three independent claims, each centered on combining thermoelectric heat pumping with a resistive heating element integrated on a thermally conductive header, controlled by a controller. Across the independent claims, the inventive features emphasize the header/thermoelectric parallel arrangement, the placement of the resistive heating element on the second header, and controller-driven concurrent operation; one independent claim further emphasizes trench-recessed resistive heating and an electrically insulating capping layer.
Thermally coupled parallel thermoelectric headers with integrated resistive heater
A thermoelectric heating/cooling device with first and second thermally conductive headers, a plurality of thermoelectric elements electrically coupled by conductive traces on the first and second thermally conductive headers and thermally coupled in parallel between the first and second thermally conductive headers, and a resistive heating element integrated in a surface of the second thermally conductive header configured to generate resistive heat in response to a resistive heater control signal, wherein the second thermally conductive header is between the resistive heating element and the plurality of thermoelectric elements.
Controller-driven simultaneous thermoelectric pumping and resistive heating
A controller coupled to at least one of the conductive traces and to the resistive heating element, configured to apply a thermoelectric control signal to the plurality of thermoelectric elements to pump heat from the first thermally conductive header to the second thermally conductive header while applying the resistive heater control signal to the resistive heating element on the second thermally conductive header.
Temperature control of a thermal load using thermoelectric pumping plus resistive heating
A temperature control device configured to control a temperature of a thermal load comprising a thermoelectric heating/cooling element with first and second thermally conductive headers and a plurality of thermoelectric elements electrically connected by conductive traces and thermally coupled in parallel between the first and second thermally conductive headers, a resistive heating element integrated in a surface of the second thermally conductive header configured to generate resistive heat in response to a resistive heater control signal, and a controller configured to apply a thermoelectric control signal to pump heat while applying the resistive heater control signal to provide heating of the thermal load.
Trench-recessed patterned resistive heater with insulating capping layer on second header
A thermoelectric heating/cooling device having first and second thermally conductive headers, thermoelectric elements thermally coupled in parallel between the first and second thermally conductive headers, where the second thermally conductive header includes a trench in a surface opposite the thermoelectric elements, a resistive heating element on the second thermally conductive header comprising a pattern of an electrically conductive material recessed in the trench, and an electrically insulating capping layer in the trench on the resistive heating element, wherein the resistive heating element is between the electrically insulating capping layer and the second thermally conductive header.
The claims collectively cover a thermoelectric heating/cooling architecture that pumps heat between first and second thermally conductive headers using thermoelectric elements electrically coupled in parallel, while also generating resistive heat using an integrated resistive heating element on the second header. The controller applies thermoelectric control signals and resistive heater control signals to operate the combined heating/pumping function, with further claim refinements directed to trench-recessed patterned heater geometry and an electrically insulating capping layer positioned over the resistive heating element.
Stated Advantages
reduced maximum/average temperatures
claimed life increase of the thermoelectric elements
thermal path reduces thermoelectric temperature by thermally decoupling the TEC from the resistive heater
Documented Applications
IC test head with a positioning mechanism for an IC device under test (DUT) and temperature control using the described TEC/resistive heater arrangement
PCR thermocycler including a reaction vessel holder thermally coupled to both a thermoelectric heating/cooling element and an optional separate resistive heater
heating/cooling system where a thermal load thermally decouples the TEC from a resistive heater such that the thermal path reduces TEC temperature
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