Antimicrobial hydrocolloid dressing containing sequestered peroxide and preparation thereof
Inventors
Assignees
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Publication Number
US-10485893-B2
Publication Date
2019-11-26
Expiration Date
Abstract
This disclosure provides for an antimicrobial pressure sensitive adhesive composition that includes a sequestered peroxide source and devices that incorporate such a composition.
Core Innovation
The invention relates to antimicrobial hydrocolloid pressure sensitive adhesive compositions that include a peroxide stabilized within the hydrocolloid adhesive material. The peroxide is chemically bonded either directly or indirectly to a super absorbent material in the hydrocolloid adhesive material, and is present in an amount of 0.05% to 2% by weight within the hydrocolloid adhesive material.
A preparation process is described in which one or more components are mixed to produce a continuous phase, and a discontinuous phase comprising the peroxide is added to the continuous phase at a temperature below 99° C. The peroxide is maintained as stabilized within the hydrocolloid adhesive material through chemical bonding to the super absorbent material.
The disclosure further describes antimicrobial adhesive devices including wound dressings, bandages, and devices for ostomy, incontinence, and catheter securement, along with blanks and cutouts supported by non-stick handling layers or release liner concepts. Antibacterial efficacy testing of adhesive patches against E. coli and MRSA is described, including reported results that demonstrate antimicrobial performance for the peroxide and super absorbent containing adhesives.
Claims Coverage
The independent claim is clm-00001. It defines one inventive feature set centered on a hydrocolloid adhesive material containing a peroxide stabilized within the hydrocolloid and chemically bonded to a super absorbent material, present at 0.05% to 2% by weight, together with a continuous-phase/discontinuous-phase preparation approach adding the peroxide below 99° C. Dependent claims further refine device form factors, interface/layer features, and the mode of bonding.
Hydrocolloid peroxide stabilized with super absorbent material bonding
A hydrocolloid adhesive material comprising a super absorbent material chemically bonded either directly or indirectly to a peroxide, where the peroxide is stabilized within the hydrocolloid adhesive material.
Peroxide amount within hydrocolloid adhesive
The peroxide is in an amount of 0.05% to 2% by weight within the hydrocolloid adhesive material.
Continuous phase mixing and below-99°C discontinuous peroxide addition
The hydrocolloid adhesive material is prepared by mixing one or more components to produce a continuous phase, and adding a discontinuous phase comprising the peroxide to the continuous phase at a temperature below 99° C.
Non-stick layer
The adhesive device includes a non-stick layer on one side of the device.
Pre-selected cutout with specified shapes
The adhesive device includes a pre-selected cutout with one of square, rectangular, triangular, oval, or circular shapes.
Direct bonding of super absorbent material to peroxide
The adhesive device includes super absorbent material that is directly bonded to peroxide.
Indirect bonding with intermediate bridge as a salt
The super absorbent material is indirectly bonded to the peroxide using an intermediate bridge, where the intermediate bridge is a salt.
Across the independent claim and its refinements, the coverage centers on a hydrocolloid adhesive device in which a peroxide is stabilized within the hydrocolloid adhesive material and chemically bonded to a super absorbent material, with peroxide present at 0.05% to 2% by weight and incorporated via a continuous-phase mixing and discontinuous peroxide addition below 99° C. Dependent claims further specify structural features and narrow the bonding relationship.
Stated Advantages
Reduced peroxide concentrations while maintaining antimicrobial efficacy, improving safety.
Antimicrobial efficacy is maintained with the peroxide stabilized within the hydrocolloid adhesive material.
Documented Applications
Antimicrobial wound dressings and bandages.
Adhesive devices for ostomy, incontinence, and catheter securement.
Blanks and cutouts with non-stick handling layers or release liner concepts.
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