Ultra-sensitive, ultra-low power RF field sensor
Inventors
Pathak, Bogdan Amaru • Keller, Walter John
Assignees
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Publication Number
US-10416213-B2
Publication Date
2019-09-17
Expiration Date
Abstract
A sensor includes a hollow enclosure, an antenna disposed external to the hollow enclosure and configured to collect emission of electromagnetic energy, a circuit disposed within the hollow enclosure and comprising a low noise amplifier (LNA) connectable to the antenna, and an analog to digital converter (ADC) in a connection with the LNA, circuit connections connecting, during use of the sensor, the circuit to each of the antenna, a source of electric energy and a signal processing component, a connection between the enclosure and an enclosure of an integrated circuit (IC), whereby the antenna id disposed between the sensor and the IC, and the sensor configured to at least measure a low-level electromagnetic energy emitted from the IC.
Core Innovation
The invention relates to a low power RF field sensor for measuring electromagnetic energy emitted from an integrated circuit (IC). The sensor includes a hollow enclosure and an antenna disposed external to the hollow enclosure to collect emission of electromagnetic energy, with a circuit disposed within the hollow enclosure to process the collected emissions. The circuit includes a low noise amplifier (LNA) connectable to the antenna and an analog to digital converter (ADC) in connection with the LNA, so the sensor is configured to at least measure low-level electromagnetic energy emitted from the IC.
The sensor is mechanically connected to an enclosure of the IC using an adhesive layer disposed on an exterior surface of the hollow enclosure, where the antenna is encapsulated in the adhesive layer such that the antenna is disposed between the sensor and the IC during use. The disclosed system architecture includes signal processing for evaluating electromagnetic/RF emissions signatures, including a signature library and baseline comparison, and performing detection and response based on altered signatures. The described operation emphasizes ultra-low power operation, including subthreshold circuit design, and very low aggregate power draw, enabling continual monitoring without intrusive access to the monitored IC.
The invention further describes configurations in which the sensor is integrated with packaging structures, including an integrated circuit comprising a first hollow enclosure having a die and circuit(s), and a second hollow enclosure defined by the sensor. An antenna is disposed between exterior surfaces of the first and second hollow enclosures and is coupled to the sensor to collect low-level electromagnetic energy emitted from the circuit(s). The disclosed sensor implementation includes an energy harvesting source and power management module coupled to the LNA and ADC, with the LNA, ADC, signal processing component, and power management module disposed within the enclosure, and the antenna encapsulated within an adhesive layer so it is disposed between the sensor enclosure and the IC enclosure during use.
Claims Coverage
The independent claims are clm-00001, clm-00015, and clm-00016. Across these claims, the coverage centers on three inventive features: a hollow-enclosure sensor with an external antenna and internal LNA/ADC for measuring low-level IC emissions; an integrated IC package arrangement with two hollow enclosures and an adhesive-encapsulated antenna between them; and a sensor architecture that collects and processes electromagnetic emissions using an LNA, an ADC producing a digital frequency signal for signal processing, together with energy harvesting and power management.
Hollow enclosure sensor with external antenna and internal LNA/ADC
A low power sensor comprising a hollow enclosure; an antenna disposed external to said hollow enclosure and configured to collect emission of electromagnetic energy; a circuit disposed within said hollow enclosure comprising a low noise amplifier (LNA) connectable to said antenna and an analog to digital converter (ADC) in a connection with said LNA; circuit connections connecting, during use, said circuit to each of said antenna, a source of electric energy and a signal processing component; a connection between said hollow enclosure and an enclosure of an integrated circuit (IC) where said connection comprises an adhesive layer disposed on an exterior surface of said hollow enclosure, said antenna being encapsulated in said adhesive layer, whereby said antenna is disposed between said sensor and the IC during use; and said sensor configured to at least measure a low-level electromagnetic energy emitted from the IC.
Integrated circuit package with first and second hollow enclosures and adhesive-encapsulated antenna
An integrated circuit comprising a first hollow enclosure; a die disposed within said first hollow enclosure; circuit(s) disposed on said die; pins electrically coupled to said circuit(s) and extending outwardly from edge(s) of said first hollow enclosure; a sensor configured to at least measure and process a low-level electromagnetic energy emitted from said circuit(s) when said circuit(s) is(are) being at least coupled to a source of electric energy, said sensor defining a second hollow enclosure; an antenna disposed between exterior surfaces of said first and second hollow enclosures, said antenna coupled to said sensor and configured to collect the emission of the low-level electromagnetic energy emitted from said circuit(s); and a mechanical connection between said first and second hollow enclosures, said mechanical connection comprising a layer of an adhesive material, said antenna being encapsulated within said layer of adhesive material.
Sensor with LNA, ADC digital frequency processing, energy harvesting and power management
A sensor configured to collect and process emissions of electromagnetic energy from an integrated circuit (IC), comprising an antenna configured to collect said emissions; a low noise amplifier (LNA) connectable to said antenna; an analog-to-digital converter (ADC) coupled to said LNA, said ADC converting a frequency signal from said LNA in an analog form to a frequency signal in a digital form; a signal processing component configured to process said frequency signal in said digital form; an energy harvesting source coupled to said LNA; a power management module coupled to each of said LNA and said ADC; an enclosure, each of said LNA, said ADC, said signal processing component and said power management module disposed within said enclosure; a layer of an adhesive material on an exterior surface of said enclosure, said antenna being encapsulated within said layer of adhesive material; and said antenna being disposed between said enclosure and an enclosure of the IC during use of said sensor.
Across clm-00001, clm-00015, and clm-00016, the claims cover a sensor and packaged IC arrangement in which an external antenna collects low-level electromagnetic energy emitted by an IC, while internal circuitry including an LNA and an ADC converts and processes a frequency signal for measurement and processing. The claims further incorporate an adhesive mechanical connection that places the antenna between a sensor enclosure and the IC enclosure, and they include energy harvesting and power management within the sensor enclosure in the clm-00016 architecture.
Stated Advantages
Ultra-low power operation (including low aggregate power draw).
Selectable analog preselection filtering to prevent ADC clipping.
Continual monitoring without intrusive access to the monitored IC.
Highly sensitive measurement of low-level electromagnetic energy emissions.
Documented Applications
Tamper/counterfeit/integrity monitoring by detecting altered FPGA signatures using electromagnetic/RF emissions signature comparisons to a baseline.
Continual monitoring of EHM/RUL/fault monitoring.
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