Thermocycling system and manufacturing method
Inventors
Brahmasandra, Sundaresh • Haddock, Thomas • Duffy, Patrick • Williams, Jeffrey
Assignees
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Publication Number
US-10226771-B2
Publication Date
2019-03-12
Expiration Date
Abstract
A system for thermocycling biological samples within detection chambers comprising: a set of heater-sensor dies, each heater-sensor die comprising a heating surface configured to interface with a detection chamber and a second surface, inferior to the heating surface, including a first connection point; an electronics substrate, comprising a first substrate surface coupled to the second surface of each heater-sensor die, an aperture providing access through the electronics substrate to at least one heater-sensor die, and a second substrate surface inferior to the first substrate surface, wherein the electronics substrate comprises a set of substrate connection points at least at one of the first substrate surface, an aperture surface defined within the aperture, and the second substrate surface, and wherein the electronics substrate is configured to couple heating elements and sensing elements of the set of heater-sensor dies to a controller; and a set of wire bonds, including a wire bond coupled between the first connection point of at least one of the set of heater-sensor dies and one of the set of substrate connection points.
Core Innovation
The thermocycling system uses a set of heater-sensor dies in which each heater-sensor die includes a heating element and a sensing element. Each heater-sensor die has a first surface that interfaces with a detection chamber during operation and a second surface inferior to the first surface that includes a connection point. The set of heater-sensor dies is configured to work with detection chambers as part of the thermocycling system.
An electronics substrate is coupled to the set of heater-sensor dies at the second surface. The electronics substrate includes a first substrate surface that is coupled to the second surface of each of the heater-sensor dies, a set of apertures longitudinally spaced across the electronics substrate providing access through the electronics substrate to the set of heater-sensor dies, and a set of substrate connection points. Conductors are coupled between the connection points of the heater-sensor dies and the substrate connection points by way of the set of apertures.
Heat generated by the heater-sensor dies is dissipated by a set of heat-sink supports. A base surface of each heat-sink support is coupled to an elastic element that transmits a biasing force through the electronics substrate, thereby maintaining thermal communication between the heater-sensor dies and the set of detection chambers during operation. Optional refinements include recesses contiguous with at least one aperture, substrate connection points defined between a first and second substrate surface proximal to the recesses, a coating proximal the heating surface that mitigates reflection of light toward photodetectors of an opposing optical subsystem during operation, and heat-sink supports having an integrated cooling element.
Claims Coverage
The document provides one independent claim, supported by dependent claims that refine the electronics substrate, thermal coupling architecture, and optional optical mitigation and cooling features. The independent claim covers four main inventive features: the heater-sensor die structure, the electronics substrate architecture with apertures and connection points, conductor routing through the apertures, and heat dissipation with heat-sink supports that maintain thermal communication using elastic biasing force transmitted through the electronics substrate.
Heater-sensor dies with heating and sensing elements and detection chamber interface
A set of heater-sensor dies, each heater-sensor die comprising a heating element and a sensing element and comprising a first surface that interfaces with a detection chamber during operation and a second surface, inferior to the first surface, including a connection point.
Electronics substrate with apertures and substrate connection points
An electronics substrate comprising a first substrate surface coupled to the second surface of each of the set of heater-sensor dies, a set of apertures longitudinally spaced across the electronics substrate providing access through the electronics substrate to the set of heater-sensor dies, and a set of substrate connection points.
Conductors coupled through apertures between die connection points and substrate connection points
A set of conductors coupled between the connection points of the set of heater-sensor dies and the set of substrate connection points by way of the set of apertures.
Heat-sink supports coupled to an elastic element to maintain thermal communication
A set of heat-sink supports operable to dissipate heat generated by the set of heater-sensor dies, wherein a base surface of each of the set of heat-sink supports is coupled to an elastic element that transmits a biasing force through the electronics substrate, thereby maintaining thermal communication between the set of heater-sensor dies and a set of detection chambers during operation of the system.
Overall claim coverage focuses on a thermocycling system that maintains thermal communication between heater-sensor dies and detection chambers using elastic biasing force transmitted through an electronics substrate, while using a substrate architecture with apertures and conductor coupling to connect die connection points to substrate connection points. Dependent claims further refine the electronics substrate structure and may add optical reflection mitigation toward photodetectors and integrated cooling elements in the heat-sink supports.
Stated Advantages
Maintains thermal communication between the set of heater-sensor dies and the set of detection chambers during operation.
Dissipates heat generated by the set of heater-sensor dies.
Mitigates reflection of light toward photodetectors of an opposing optical subsystem during operation.
Heat-sink supports include an integrated cooling element.
Documented Applications
Thermocycling system for biological samples, including nucleic-acid amplification (e.g., PCR, RT-PCR) and related molecular diagnostics such as bDNA, hybrid capture, and microfluidic cartridge contexts [procedural detail omitted for safety].
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