ONBoard Solutions

High-performance X-ray inspection system for SMT and electronics offering fully manual or in-line-compatible inspection modes, high-resolution digital flat panel detectors, and upgradeable Viscom computed tomography.

High-performance X-ray inspection system for SMT and electronics offering fully manual or in-line-compatible inspection modes, high-resolution digital flat panel detectors, and upgradeable Viscom computed tomography.

Advanced 3D Manual X-ray system for BGA and QFN inspection featuring high-resolution CT imaging and automated void calculation for detailed failure analysis and quality control.

High-performance PFPE fluid engineered specifically for thermal requirements in vapor phase soldering and thermal testing, supplied in a 5 kg container.

Next generation of PanaCIM, Panasonic’s Computer Integrated Manufacturing software packages, which allows for more efficient electronics manufacturing.

A line management system that integrates data from all machines on the production floor, enabling real-time monitoring and optimization.

Soft, stretchy nitrile cleanroom gloves offering superior ESD protection, exceptionally low particle and extractable levels, and double-bagged cleanroom packaging.

Sterile nitrile glove for cleanroom and aseptic applications.

Precision vapor degreaser for electronics and cleanroom applications.

Sonictron vapour degreasing machine.

Sonictron vapour degreasing machine.

Vapour degreasing machine for precision cleaning.

The Panasonic NPM-GW is an SMT pick-and-place machine built for large PCBs, heavy BGA placement, and high-load component mounting.

Tester designed to measure ionic contamination levels on printed circuit boards after cleaning or assembly.

Elite 3D AOI system featuring XM-3D sensor technology and high-speed inspection. Delivers 360-degree, shadow-free volumetric measurements for zero-defect SMT manufacturing.

The Panasonic NPM-D3A is an SMT pick and place machine designed for high-speed, high-precision component mounting using a dual placement method and lightweight 16 nozzle head V3A.

High-quality ESD glove with 20% carbon anti-static and shielding electromagnetic waves with optimum comfort and dexterity.

Compact, high-precision vapor degreaser with PLC controls and efficient solvent recovery. Ideal for residue-free cleaning of PCBs and small mechanical components in R&D and production.

Specialized personal protective equipment designed for the safe handling of hot printed circuit boards and components in static-sensitive environments, providing dual thermal and ESD protection.

The Panasonic NPM-GH is a high-precision SMT placement machine engineered for micro-component accuracy and high-speed production, achieving a high accuracy of ±10μm and improved catalog speed.

Anti-static nylon gloves with PU palm coating for superior dexterity and grip. Designed with color-coded wrists for easy size recognition, protecting ESD-sensitive components during assembly tasks.

Allergy-free latex ESD finger cots with a superior surface resistance, ideal for protecting sensitive electronics from static and skin oils while maintaining maximum dexterity.

Full carbon ESD gloves for electrostatic discharge protection.

Advanced Highly Accelerated Thermal Shock (HATS²) tester for simulating convection reflow assembly and evaluating PCB and substrate reliability, featuring a wide temperature range of -65°C to +265°C and real-time 4-wire resistance monitoring.

The Panasonic NPM-W2 is a pick and place machine designed for high-volume SMT assembly, offering high productivity, versatility for large PCBs, and advanced process control.

High-performance 3D AOI platform offering high-resolution angled and top-down inspection. Ensures comprehensive defect detection and Industry 4.0 compatibility for reliable SMT lines.

A versatile machine that supports both SMD and THT components, offering flexibility in mixed-technology assemblies.

High-capacity, horizontal dualsump vapor degreaser engineered for heavy-duty industrial cleaning and high-reliability electronics manufacturing, featuring separate boil and immersion stages.

High-speed placement and accuracy machines capable of handling a wide variety of components.

Fully customizable 2-stage ultrasonic vapour cleaning machine including one boiling sump and rinse sump, PLC controlled operation with coloured touch screen HMI, and dual free-board cooling systems.

The MBTech NC25E is a precision aqueous cleaning platform engineered for the high-reliability removal of flux residues from printed circuit boards. It utilizes a unique 4-stage process including wash, rinse, final rinse, and high-velocity drying, with a closed-loop water treatment system.

Offline X-ray inspection machine for electronics assemblies.

Offline X-ray inspection machine for electronics assemblies.

Large-format configuration of the CM Series ionic contamination tester with a 35.14 L tank volume.

High-performance industrial solution designed for the precision cleaning of complex electronic assemblies and mechanical components using a two-stage ultrasonic immersion and pure vapor rinse process.

Configuration of the CM Series ionic contamination tester with a 5.25 L tank volume.

Production-grade Parylene deposition system engineered to apply precise conformal coatings through molecular-level polymer deposition at ambient temperatures with proprietary Windows-based control software.

Cleanroom product offering available through ONBoard Solutions.

Ultra Fast Inline 3D AOI System offering extremely fast and precise inspection for high-volume production with reliable quality assurance.

Cleanroom product offering available through ONBoard Solutions.

Benchtop Ionograph ionic contamination test systems offer efficient and accurate testing to meet the needs of any lab or manufacturer.

Vertical multi-chamber configuration of the CM Series ionic contamination tester with a 10.5 L tank volume.

Cleanroom product offering available through ONBoard Solutions.

12-inch white nitrile cleanroom gloves designed for contamination control.

The Panasonic AM100 is a versatile SMT assembly machine built for flexible, one-machine production across diverse mounting sites, featuring a 14-nozzle head and support for large-capacity component supply sections and long PCBs.

High-accuracy selective coating and dispense system featuring programmable tilt/rotate, laser-height mapping, and fiducial recognition for repeatable, high-throughput circuit protection.

Industry-leading vacuum-deposited Parylene coatings. Solvent-free, pinhole-free, and truly conformal, providing elite moisture and chemical barriers for medical, aerospace, and defense electronics.

Die bonder system for microelectronics packaging.

Conformal coating machine designed for selective coating of electronic assemblies.

Humiseal UV500 UV Curable Conformal Coating with wide thermal cycle performance and UL approval.

Humiseal UV50LV UV Curable Conformal Coating with wide thermal cycle performance.

DIE bonder component placer for microelectronics assembly.

A fully-enclosed programmable 3-axis robot designed for optimal precision and efficiency, ideal for R&D enterprises, laboratories, and low-volume production.

Stencil wipes for SMT and electronics manufacturing.

Humiseal UV40 UV Curable Conformal Coating with instant touch dry and acrylated urethane base.

Ensure the longevity and resilience of your PCBs and electronic assemblies with AB Chimie UVA59 Urethane Aqueous Conformal Coating

Semi-automatic wire bonder system.

Flexible wire bonder with a working area of up to 512 x 720mm, well suited to battery bonding and other large-component applications. Features an unbeatable price-to-performance ratio, unlimited bond program storage, and powerful pattern recognition.

A fully automatic bonding machine with manual part feeding, offering unbeatable flexibility through changeable bond heads for all wire bonding and testing processes.

HumiSeal 1B73 is a high-performance, single-component acrylic conformal coating that carries prestigious UL approval, ensuring it meets strict safety and flame-retardancy standards for electronic assemblies.

High-speed automated tabletop wire bonder capable of bonding at speeds exceeding one wire per second. Features exchangeable bondheads, powerful pattern recognition, and unlimited program storage for high-productivity microelectronics.

Gel version of Humiseal UV40 UV Curable Conformal Coating.

An Adaptive Process Control system that monitors and adjusts the placement process in real-time, ensuring consistent quality.

Battery bonding system for microelectronics and assembly.

An industry-standard, single-component acrylic conformal coating engineered to provide exceptional moisture and environmental protection for printed circuit assemblies. It features fast-drying properties, excellent flexibility, UV fluorescence for inspection, and easy repairability.

Humiseal UV40HV UV Curable Conformal Coating with higher viscosity.

Humiseal 1A33 Urethane Conformal Coating with room-thermal cure type and UL approval.

Fully automated DIE bonder for flexible high precision bonding.

Manual DIE bonder for precision placement.

Low viscosity silicone conformal coating with moisture and thermal cure, designed to be sprayable.

Fast touch-dry sprayable silicone conformal coating with moisture-thermal cure.

Silicone conformal coating offering moisture and thermal cure with high viscosity, suitable for hand application and dispensing.

Manual die bonder for precise semiconductor die placement.

Cost-effective quality assurance solder paste inspection system for high-precision PCB inspection.

Multi-function platform for precision electronics manufacturing and coating processes.

Acrylic removable coating material designed for electronics assembly conformal coatings.

Cleanroom gloves designed for reliable barrier protection.

Testing equipment used for electronics manufacturing quality assurance.

Thermal cure silicone conformal coating suitable for spray and dip applications.

The FS BONDTEC Series 53xx Manual Wire Bonder serves as a highly versatile and robust base platform designed to accommodate a wide range of interchangeable bondheads, making it the Swiss Army Knife of microelectronic assembly.

Gold wire bonder for microelectronics manufacturing.

The Dyneema® Cut-Resistant Glove is the premier choice for technicians and operators requiring high-level hand protection without sacrificing tactile sensitivity or comfort. Utilizing genuine Dyneema® fiber, these gloves provide an exceptional strength-to-weight ratio, offering reliable defense against mechanical and cut hazards in industrial assembly and cleanroom maintenance.

Manual thin wire wedge bonder optimized for high-density microelectronic packaging, capable of handling aluminum and gold wires as well as ribbon.

Offline X-ray counter for electronics component and reel counting.

Precision Type 4 (20-38 micron) lead-free solder paste designed for ultra-fine pitch components. Offers superior stencil release and thermal stability for high-density surface mount technology.

COATS technology cleanroom gloves for enhanced skin care and protection.

Thin wire deep access bonder.

Pull and shear testing system for wire and die bonds.

Promosolv 70IS is a non-flammable defluxing solvent from Inventec Performance Chemicals, developed as a drop-in replacement for trichlorethylene, NPB and other solvents while reducing HSE impact. It is dedicated to removing reflowed flux residues and contaminants from PCBAs, power modules, lead frames, BGAs, PoP, SIP applications and LED assemblies.

No-clean lead-free solder paste for reliable manufacturing joints.

High-performance flux for electronics manufacturing assemblies.

Thin wire deep access bonder for microelectronics applications.

Promoclean Disper 707 is a concentrated, aqueous-based cleaner from Inventec Performance Chemicals, formulated to remove flux residues in electronics manufacturing. It is diluted with deionised water before use and is designed for spray-in-air and immersion jet cleaning processes.

Panasonic Auto Setting Feeder (ASF) is an automated tape feeder for surface mount technology (SMT) component mounting lines, designed to greatly reduce the working time involved in parts supply setup. It automates the process of setting new tape components, cutting setup time from approximately 90 seconds with a current feeder (ITF) to approximately 30 seconds with ASF.

Lead-free T5 fine feature solder paste for advanced electronics assembly.

Thin wire wedge-wedge bonder.

A standalone programmable three-axis robot ultrasonic full coating solution employing robust ball-screw slides driven by brushless DC servo motors.

Lead-free T3 solder paste for electronics assembly.

Pull and shear tester compatible with the Series 56xx setup.

Leaded solder paste T4 for SMT assembly processes.

The FS BONDTEC 5310 is a high-precision manual ball bonder designed for the economical and flexible production of microelectronic connections using gold wire ranging from 17.5 to 50 um.

Heavy wire bondhead system.

Gold-Ball bond head with contactless electronic touchdown sensor and deformation limit control.

Ecofrec 303 is a high-reliability, VOC-free, no-clean liquid flux designed for high-performance wave soldering and selective soldering applications, featuring a water-based chemistry.

Heavy wire bonder for microelectronics packaging.

Thin wire deep access bondhead designed for complex microelectronics packaging architectures.

Lead-free T4 solder paste for high-quality electronics assemblies.

Cleaning and flux removal solvent for electronic assembly, specially developed for the removal of flux residue and undesirable contaminants from printed circuit boards.

UVLED curing system designed for rapid and efficient conformal coating cure.

Heavy wire bonding system.

Topklean EL-20A is a specialized, high-performance cleaning agent designed specifically for the removal of all types of solder flux residues, including No-Clean, Lead-Free, and Rosin-based formulas. This hydrocarbon-based solvent is optimized for manual cleaning, dipping, or low-pressure spray applications.

Thin wire wedge-wedge bonder for microelectronics.

Leaded solder paste formulated for strong and reliable electronics assembly joints.

Promoclean TP188 is a high-performance, water-soluble detergent designed specifically for the removal of solder paste and flux residues in automated spray-in-air and ultrasonic cleaning systems. This aqueous formulation is optimized for lead-free and no-clean soldering processes.

PROMOCLEAN DISPER 607 is a water based cleaner formulated to remove all types of baked-on flux residues left on printed circuit board assemblies.

Heavy Wire bond head for high-durability aluminium and copper wire applications.

Ball-deep access bondhead system.

AlphaTec 2000 protective coverall.

SAC305 lead-free solder bar for wave soldering and reflow processes.

Lightweight nylon gloves for general handling in manufacturing.

Technical cleaning fluid specifically formulated for use in advanced vacuum cleaning systems and automated spray-under-immersion processes. Optimized for ultra-fine-pitch SMT assemblies, offering high stability and superior flux removal in closed-loop processes.

Heavy ribbon bonder for microelectronics packaging.

Heavy ribbon bondhead system.

Cleaning and de-fluxing solvent for PCB applications.

Flexible epoxy formulation for electronics and microelectronics bonding applications.

Thin Wire Deep Access bond head tailored to constricted geometries.

Heavy ribbon bonding system.

Topklean EL 10F is a multi-purpose electronic cleaner formulated for the removal of flux residues, non-reflowed solder pastes and uncured glues.

Two-part high strength silicone gel featuring moisture-chemical cure and fast curing time.

Epoxy formulation for electronics and microelectronics bonding applications.

Optically clear epoxy adhesive for microelectronics and assembly.

Thin Wire Wedge-Wedge bond head with convertible wireguide and digital ultrasonic generator.

Heavy Ribbon bond head for aluminium ribbons up to 2mm width.

Heavy wire bond head for aluminum wire 100-500 micrometers, copper wire 100-300 micrometers, with Deformation Limit Control (DLC) for real-time quality checks.

Clean room compatible high end version goggles with adjustable strap and premium anti-fog lens, suitable for cleanrooms with controlled contamination and aseptic conditions.

Automatic Pull & Shear Tester test head equipped with changeable cartridges, camera system for automatic testing, and analysis software.

Automatic Pull & Shear Tester equipped with exchangeable test head cartridges and automated camera system.

Aqueous / Semi-Aqueous Stencil Cleaner single batch spray cleaning system suitable for stencil & misprint PCB cleaning.

A 4-axis automated soldering robot equipped with teach pendant, heating controller, solder wire feeder, soldering iron, tips, and tip cleaner.

SN100Ma lead-free solder bar for wave soldering applications.

AlphaTec 2000 protective overboots.

Lead-free flux remover for electronics soldering applications.

Temperature profiling unit distributed by ONBoard Solutions.

FM100 Disposable Face Mask 180mm x 90mm x 2 ply

Heavy ribbon bond head supporting aluminum ribbons up to 2mm width with programmable bond force up to 4,000 cN.

Laboratory bond pull tester for quality testing in microelectronics manufacturing.

The SCS Labcoter gives university and R&D laboratories the best in Parylene coating technology, in a compact, portable system, enabling researchers to develop and design with the polymer Parylene.

HumiSeal UV92 UV Curable Masking Gel with thixotropic paste and acrylated urethane base.

Non-Skid Shoecover is a lightweight nonwoven cover designed to protect footwear and floors in cleanroom and controlled environments. With a smooth, soft, uniform finish and secure, durable construction, it is suited to extended wear across a shift.

Cleanroom hood for complete operator coverage and contamination control.

Launderable cleanroom coveralls from Alsico.

Booties designed for cleanroom use from Alsico.

High-BFE 3-ply procedural face masks with comfortable earloops and an adjustable nose bridge. Provides fluid resistance and effective particulate filtration for medical and technical environments.

Professional-grade rework fixture designed to provide a stable and adjustable platform for de-soldering BGA chips and other high-pin-count components with a combined working plate design.

Micro-abrasive blasting system for precision coating preparation and surface treatment.

Workstation for precision micro-abrasive operations and coating applications.

A4 size cleanroom paper.

The QUICK 201B is a professional-grade desoldering station featuring a powerful built-in vacuum pump and a 90W heating element for efficient through-hole component removal. Utilizing a closed-loop sensor for precise temperature control, it offers a range of 200 u00b0C to 450 u00b0C, ensuring that even heavy solder joints are melted quickly and cleanly.

A4 cleanroom notepad.

DEC-SPORE 200 is a peracetic acid and hydrogen peroxide-based sterilant, virucide, disinfectant, sanitizer and alkaline detergent booster supplied in the SimpleMix format for pharmaceutical manufacturing environments.

Specialised shoes for cleanroom and medical use.